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It is generally agreed that optical lithography will run out of steam once 193-nm technology has reached its full potential. For some, 0.15-micron geometries may be the end of the road, and for others, with a much greater threshold for pain, the limit may be closer to 0.10 micron.Any discussion of lithography`s future requires perspective and an understanding of past lessons, particularly those revealing lithography`s inherent weaknesses.

J.P. Chang, R.L. Opila, G.B. Alers, M.L. Steigerwald, Bell Labs, Lucent Technologies, Murray Hill, New Jersey, H.C. Lu, E. Garfunkel, T. Gustafsson, Rutgers, The State University of New Jersey, Piscataway

Established CVD oxide processes can be fine-tuned toproduce air gaps between metal lines to lower the k of interconnect dielectric stacks. Design constraints and integration challenges exist, but air gaps may be easier to integrate than completely new low-k materials. Manufacturable processes can reduce interconnect capacitance by as much as 40-50% for tightly spaced metal lines.

The I-Scan system uses a paper-thin (<0.08 mm), flexible, grid-based sensor that is composed of conductive and semi-conductive inks. The intersecting points of the grid`s conductive rows and columns form the sensing locations, and by separating the rows and columns with a material that varies its electrical resistance with applied force, each intersection of the sensor becomes a force sensor. The computerized system electronically scans and measures the change in resistance at each sensing cell

The Ultrapure PPT on-line total organic carbon (TOC) analyzer offers the highest accuracy for low-level TOC monitoring of ultrapure water. With its standard delivery system, PPT can be user-calibrated, on-line. Verification of calibration, at TOC levels down to 1 ppb, can also be completed on-line, and on-line calibration of resistivity/conductivity is easy to perform. Employing membrane-conductivity technology, the system eliminates the false positives that are typical of older on-line technolo

The DPS STI Centura system, for etching shallow trench isolation (STI) structures in advanced logic and memory devices, delivers very good on-wafer results for sub-0.25-?m devices and increases the productivity available from a shallow trench isolation etcher. The system`s process methodology results in a nondepositing application, eliminating the need for time-consuming dry chamber cleans and improving throughput and system uptime. This mode of operation also eliminates the process drift and du

Starfire 3.0, a groupware system for engineers, offers a more manageable environment for manufacturing process development, new product introduction, and technology transfer. It is used systematically to define, characterize, and optimize critical manufacturing processes, and makes possible a consistent and predictable reduction in variability in products, processes, and analytical systems. Starfire combines four major elements in a software system: it automates a proven methodology for manufact

China continues to attract and mystify Western entrepreneurs who seek to enter its market. The story behind Motorola`s successes in China - how it "broke the ice" with semiconductors - reveals many lessons that can be valuable to others who aspire to do business with or in China, especially those involved with high-technology endeavors.

Data gathered recently from SEMI members provide a perspective of regional reactions by semiconductor manufacturers in Asia to the current economic crisis. These data also reveal a possible scenario in these countries when recovery ensues.

Taiwan`s semiconductor capital equipment market will represent a larger share of the world market in 1998. At the same time, the foundries, which are primary buyers of the equipment, are undergoing a transformation, in tune with global trends made evident at the recent SEMICON Taiwan show in Taipei.

Despite recent predictions of its demise, optical lithography is now poised to sustain semiconductor manufacturing beyond the turn of the millennium. Indeed, there are indications that it can be extended to the application of 157-nm wavelength, two generations beyond today`s leading edge.

Recently, we heard a comment from someone in the industry suggesting that the SIA`s National Technology Roadmap had become irrelevant. The complaint was that some features were shrinking well ahead of the 1997 Roadmap timetable, and that the projections for optical lithography and next-generation lithography had proven to be way off the mark (see more about this in "Optical lithography to 2000 and beyond," p. 31).

LETI in France and IMEC in Belgium have created a platform enabling academic and industrial institutions in Europe to execute advanced research projects.

ASML`s 193-mm step-and-scan system has demonstrated imaging capabilities for 100-nm R&D, a result of a joint 193-nm process development alliance formed two years ago by Belgium`s IMEC and the Netherlands` ASML. Other results show that the system appears to be compatible with pilot

Aixtron AG, Aachen, Germany, will participate in two Centers of Excellence in nanotechnology sponsored by the Germany Ministry for Education, Science, Research, and Technology. The NanOp - Applications of Nanostructures in Optoelectronics center will study the application of the quantum effects in nanostructures, measuring several millionths of a millimeter, in future optoelectronic components. Applications for innovative products include laser-TV, lighting systems, screens, and displays. The Ce

Despite economic difficulties and a spotty technology base, Romanian institutes and companies are engaged in semiconductor development work, and are seeking international development partners.

Designed for advanced IC packaging and printed wiring board production, Models 5150 and 5200 laser drilling systems drill blind and through micro-vias in all materials used in electronics production. An ultrafast beam positioner substantially decreases the time taken to move between drilling locations. Model 5200 features solid-state, diode-pumped laser drilling technology, which offers very good reliability and uptime as a result of reduced maintenance requirements (diodes need replacement only

ENCore Dual Lane Encapsulation systems offer the continuous benefits of dual-lane processing for advanced packaging and assembly encapsulation applications, including die coat, dam and fill, glob top, chip underfill, and cavity fill. Because they are modular, they can be expanded into multi-unit systems. Ergonomic design, coupled with sophisticated control and process monitoring, offer features that include on- or off-line programming, self-diagnostic software, and a powerful Windows NT environm

The MAX3 dynamic burn-in system features burn-in voltages as low as 0.7 V DC, providing a single burn-in solution for ICs with linewidths =0.18 ?m. The system also features 96 I/O channels, allowing a more complete exercise of higher pin-count devices and production of more reliable ICs. Other features include: memory patterns for both standard and embedded memory; vector patternsfor logic; reconfigurable vector memory to 24 Mb deep for boundary scan applications; high-current capabilities for h

This "no flow-flux" underfill encapsulant reduces cycle time in flip chip assembly. The underfill eliminates the separate fluxing, cleaning, and underfilling steps because the adhesive itself performs the dual role of fluxing the interconnects, then curing to become the underfill layer. Also, the underfill can be cured during the solder reflow process; there is no need for a separate curing cycle. Commercial flip chip tests have shown the underfill`s durability: following three reflow cycles it

Tungsten nitride (WN), when used as an electrode material, results in 10 times lower leakage for Ta2O5 capacitors than other electrode materials such as TiN. This new CVD technique deposits WN that uniformly coats the intricate structures which are present in modern DRAM capacitors, controlling particles and repeatability to the current tight production requirements. The film is available on the production-proven LYNX2 single-wafer cluster tool, a multiple-film system with up to four-module capa

The Mini-Gaskleen purifier offers a combination of chemically reactive materials and a stainless steel filter medium to create a true point-of-use purifier for applications up to 1 slpm. The chemically reactive material is used to reduce impurities such as O2, H2O, CO2, and CO to <1 ppb. The sintered SS filter medium provides >109 particulate removal efficiency of >0.003-?m particles up to the rated flow. The purifier has superior pressure drop characteristics and can purify a wide variety of g

The V Series FTIR-based analyzers, designed for measurement of trace H2O contamination in corrosive gases, can reach the lower detection limit of 10 ppb of H2O in matrices of HCl, HBr, and NF3. These results are attained in real time, with measurement intervals <1 min. The spectrometer compartment is evacuated (to 10-5 torr) to eliminate background atmospheric moisture, rather than the conventional approach of purging the instrument. This reduces setup times to 24 hours. MIDAC Corp., Irvine, CA;

EnChem is a proprietary polymer process allowing selective filtration of both dissolved and suspended contaminants in CMP, fluorinated chemistries, and copper interconnect applications. It is engineered to treat CMP wastewater streams to remove H.F., silica, copper, tungsten, alumina, and silicon materials. The system will replace processes used in copper electroplating waste processing and is more effective than electrowinning copper waste. Unlike traditional filtration systems, EnChem can trea

IBM has moved silicon germanium (SiGe) technology into high-volume, mainstream manufacturing on 200-mm wafers at its Burlington, VT, facility. Until now, the benefits of SiGe techno-logy have been relegated to alternative, specialty ICs, particularly for mainframe computing applications, manufactured in pilot production.

Increasingly for sub-50 ? gate films, semiconductor manufacturers are demanding thin-film metrology tools matched to better than 0.5 ?; even a few atoms thicker or thinner than specification can adversely affect the performance of the finished device. Now such performance, even across fabs in different worldwide locations, can be purchased with metrology tools from Rudolph Technologies Inc. (RTI); its Ultrathin Film Support Program sets, maintains, and transfers a baseline for thin-film accuracy

At Selete`s recent 300-mm Program Evaluation Progress Announcement Conference in Tokyo, officials discussed interim results of a study of front-opening unified pods (FOUPs) for wafer handling, and outlined plans for a coming study of 300-mm materials handling. Selete forecasts that world semiconductor sales will bottom out, then rise this year, and that capital investment will start to increase in 2000.

One of the clearest trends in chipmaking over the last few years has been the increasing rate of design rule shrinkage. Quarter-micron production began in 1997, and manufacturers rapidly went to 0.23, 0.21, and 0.2 ?m, with 0.18 planned for many fabs in the first half of 1999 - a two-year generational cycle.

The Japanese chip market is at first expected to fall to 3.37 trillion yen for 1998, down 13.3% from a year earlier, but then rise for the next three years (see table), according to the Electronics Industries Association of Japan (EIAJ). The international semiconductor market was estimated at $122.23 billion for

Japan`s LCD manufacturers have revised their sales forecasts for the current fiscal year, with shortfalls running from 6% to almost 40%. As a result, most of the companies are also cutting planned capital investment beyond earlier levels, which had already anticipated a drop of more than half from the previous FY. It now appears that FY98 spending will be just 28% that of FY97.

Tokyo Electron Ltd. (TEL) is feeling the industry downturn in many regions, but US sales are continuing to increase this year, says Barry Rapozo, president of Tokyo Electron America (TEA). With TEL`s strategic effort to boost US sales, TEA is adding support personnel, but does plan cost controls. Meanwhile, TEL`s Japan operation has not had a

November equipment book-to-bill climbs. Orders at North American semiconductor equipment and materials companies again showed solid month-to-month gains in November, rising 29% to $805.0 million (see table). Shipments also ticked up 15% to $962.9 million, for a resulting book-to-bill ratio of 0.84, according to SEMI. Nevertheless, bookings are 51% below November1997 levels, while the three-month average shipments are down some 41%. A return to strong growth will likely not come before chipmakers

The Focus Center Research Program - the brainchild of the semiconductor industry, the federal government, and 14 US-based universities - has officially been established to explore R&D chipmaking issues. Two centers have been established, one for design/test issues led by the University of California at Berkley and a second for interconnect issues led by the Georgia Institute of Technology. R&D agendas are focused on new technologies for commercialization. Future research agendas will be based on

STEAG Electronic Systems, Pliezhausen, Germany, is in discussions for a cash acquisition of AG Associates, San Jose, CA, a supplier of rapid thermal processing equipment. The acquisition is expected to value the equity of AG in excess of $30 million. In addition, STEAG has delivered its MECAPOL E550 polishing system to the French Institute LETI for polishing silicon and silicon dioxide. The dry-in/wet-out process is designed for 200-mm and smaller wafer sizes.

Toshiba Corp. and Fujitsu Ltd. will begin development work for 0.13-?m, 1-Gbit DRAM technologies, including capacitor insulators, under a 30 billion yen ($253 million) joint project. The agreement calls for the completion of 1-Gbit DRAM prototypes by March 2002. About 100 researchers will work out of Toshiba`s Advanced Microelectronics Center in Yokohama.

Amkor Technology, a provider of packaging and test systems, is endorsing South Korean subcontractor Anam Semiconductor Inc. in its pursuit of a "Workout" financial restructuring program. The program was established to assist viable Korean companies in restructuring their debt. In addition, Amkor will begin running a 0.21-?m, 0.18-?m effective gate length process at its fab in Buchon, South Korea, for fab partner Texas Instruments.