Issue

Donald balanced his family budget with difficulty. He called his three sons - Al, the eldest, Ben and Cory, the youngest (who was four years Al's junior)

PHOENIX - In SRC's Copper IC Design Challenge, a national technology contest for university students that encourages exploration of the possibilities of copper in leading-edge IC manufacturing

I can't help but be amazed by the investment community's growing interest in semiconductor packaging. I would have thought that the packaging industry as a whole significantly lacks in glamour when compared to the high-flying (and fast-crashing) dot coms, and software, biomedical and pharmaceutical companies

The NXR-1510 is a new full-featured, automatic X-ray inspection and quality assurance test system

What a year this has been! Advanced Packaging magazine has seen many great changes this year: a new and invigorated staff...an enthusiastic publisher...a renewed commitment to the industry...a fresh new design

Business models, roadmaps and a little black magic: An interview with Bob Hilton

Consumer demands for miniaturized portable wireless applications and personal electronic devices have become the driver for reduced manufacturing costs and smaller integrated circuit (IC) packages

The advent of semiconductor materials being converted into electronic functions set off a revolution in electronic systems design

All laser vector marking systems work in essentially the same way. Typically, the vector marking system marks on a component while the component is stationary

Precision techniques to optimize process results for advanced packaging applications

Process considerations can ensure value and performance from package visual inspection systems

Transitions in polymer mechanical and dielectric properties accompany glass transition, a second-order phase change.