Issue

At this year's sports day, each of the three divisions - Mechanical, Electrical and Civil - won 16 medals of gold, silver and bronze

Amkor Technology and Toshiba Corporation's Semiconductor Company have signed a non-binding memorandum of understanding to establish a joint venture assembly and test operation located at Iwate Toshiba Electronics Co. Ltd. in Kitakami, Japan

Each fall, the International Microelectronics and Packaging Society (IMAPS) hosts a symposium and exhibition that attracts more than 6,000 scientists and engineers in microelectronics and packaging

ASG has announced new assembly tools for use with work pieces that are sensitive to electrostatic discharge

BGAs, BGAs, BGAs everywhere! How many different types of BGAs are there? There are BGAs that use ceramic substrates, organic substrates, flex tape substrates, thin film substrates and metal (leadframe) substrates

Having been involved in various aspects of electronics assembly for more years than I care to admit, I find it interesting to review the challenges that have been presented to assembly engineers

Contrary to conventional wisdom, the term "embedded electronics" does not just refer to the TV remote you just dropped into your pizza or the stereo earphones sticking in your ear canals - it denotes a whole new concept of electronic packaging

When it's this good, why wait? That was our thinking behind the redesign of Advanced Packaging magazine that you now hold in your hands

Generally speaking, test is the process of attempting to sort defective products from non-defective ones. The integrated circuit (IC) manufacturing process creates defects such as contamination

Self-imaging polymer systems offer ease of use and improved resolution

Two types of materials replace leaded solders effectively

Study indicates that vibration prolongs thermal fatigue life of BGA solder joints

Automated PVI supports current and future inspection requirements, reducing production costs and minimizing defects.