Issue

With the trend toward smaller packages and tighter tolerances, the role of total package inspection is becoming more vital to the assurance of final product quality. At the same time, the drive for cost reduction and flexibility dictates that all inspection requirements be satisfied by a single, integrated, high-throughput inspection platform.

Assembly process parameters, material selection and board geometry affect yields and reliability during attachment of CSPs onto organic motherboards.

A low-temperature processable ternary gallium alloy proves useful for microelectronic packaging interconnects.

Fine I/O pitch and tiny solder balls require careful considerations for flux transfer and ball placement.

Four entrepreneurs - Amber, Beryl, Carrie and Denise - each purchased a rectangular lot to build a factory

All too many times, we engineers suffer from extreme opinions regarding areas of personal expertise

Circuit manufacturers are more accepting of bare die than they were in the past

New is a series of miniature-profile guideways that reportedly make precision motion control economical for tightly packaged applications

How does a new product or technology reach its customers, gain a strong market share or become an industry standard?

Bonding technology is driven by the reduction of package size and lower assembly costs. Additionally, ultra-fine-pitch applications with shorter bond pad distances are creating both opportunities and challenges

IBM Microelectronics, a leader in ASICs design and manufacturing, and Xilinx, a leading innovator of complete programmable logic solutions, have recently announced an agreement to combine cutting-edge technologies to create a new generation of chips for use in communications