Issue

The use of inherently dissipative polymer alloys is the first step to reduce ESD in fluid dispensing.

Detailed processes are involved in underfilling flip-chip assemblies, and a variety of fluid formulations and dispensing alternatives are available to today's flip-chip process engineer.

In selecting thermal solutions, packaging designers can easily agree that minimizing thermal resistance is critical, and numerous articles now focus on performance and improvements in thermal resistance of interface materials.

As the use of unpackaged semiconductor devices becomes more widespread, the need for the reliable availability of KGD becomes increasingly important.

Four engineers focus on versatile lighting's serious impact on substrate imaging. Machine vision, used for substrate recognition, component centering/inspection and machine setup procedures, is an essential component of today's advanced automated assembly equipment. Machine vision's primary task - distinguishing features of interest from the background - is easier if the input image has a high degree of contrast.

Suspension Profile System

A wide variety of coating and dispensing equipment is available to meet the needs of semiconductor packaging and flip chip underfill applications. The following is a sampling of platforms, valves, pumps, jets, syringes and other items that address the increasingly complex needs of dispensing applications.

Digital wireless content is everywhere. Cellular phones, internet applications, pagers and other personal communications devices are capable of receiving and storing a wide variety of message types, including e-mail, voice, fax and executable code.

Contrary to conventional wisdom, drivers for environmentally safe products exist in addition to government legislation. Electronic companies are concerned about environmentally safe designs, manufacturing processes and product recycling. What's more, from the commercial side, environmentally friendly products appeal to consumers who, with each generation, are becoming more environmentally conscious.

Capitalizing on advanced intellectual property (IP) delivery and rapid silicon prototyping tools (two of the major dividends that resulted from its recent acquisition of VLSI Technology), Philips Semiconductors has launched a design methodology that will allow the vast pool of IP to be used quickly and effectively.

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There are four primary substrate types used for ball grid array (BGA) packages: ceramic, plastic PCB materials, such as bismaleimide triazine (BT), metal and flexible tape. Of these, the most widely used and accepted are BT substrates and flexible tape.