DEPARTMENTS
Feature Products
Surface Mount Pin Receptacles
Surface mount pin receptacles are discrete sockets that permit lead components to be plugged into SMT circuits. They are supplied on tape per EIA-481 for assembly with industry standard pick-and-place equipment and are made by press-fitting a stamped beryllium copper spring contact into a precision-machined housing. Mill-Max offers 35 sizes to accept pins ranging in diameter from .012 to .102 inches, as well as square and rectangular component leads.
Feature Products
BGA Prototyping Adapter
The 1.0 mm BGA prototyping adapter uses a zero insertion force socket, which enables multiple chip testing of up to 10,000 insertions. The adapter eliminates the need to design-in additional signal access pins/points, prevents board revisions, is easily removed and has a low profile for minimal clearance. Delivery is stock to 10 days.
Feature Products
Surface Enrichment System
The SE contact system enables metallized particle interconnect to interface to a tin/lead surface. SE provides a means of interfacing LGA and BGA packages to the printed wire board (PWB) and works on both tin/lead pads on the PWB and eutectic solder balls on a BGA package. SE fulfills the low profile requirement of 5 mm stack height for notebook computers and is scalable to 0.8-mm pitch in pin counts from 400 to 5,000.
Feature Products
Plug and Socket System
The 3M .8 mm Board-to-Board Straight Surface Mount Plug and Socket Interconnect System is a 200 position, PCB stacking interconnect. It is parallel mounted and has snap-in connections and polarized contacts. It features beryllium-copper alloy active contacts with bellows design, a high insertion/withdrawal rate, a 1.8 mm mating length and a 5.0 mm PCB stacking height.
Feature Products
Press-fit Connectors
Multi-line Module 2 mm hard metric press-fit connectors meet CompactPCI/IEC 1076-4-101 specifications and are available with type A, B and C right angle receptacles for daughter cards, type A, B and C straight plugs for backplanes, type A, B and C shrouds for backplanes and coding keys for type A. The 8071 series receptacles are available with 55, 95, 110 and 125 signal contacts arranged in five-pin rows plus shield, while plugs have five signal rows plus two ground rows. The connectors provide
New Products
Thermal-profiling Software
Thermal-profiling software is now offered as an option by Radiant Technology Corp. (Fullerton, Calif.) on its full product line of ovens and furnaces used for semiconductor packaging, FPDs, hybrid thick film firing, photovoltaics and PCB assembly. The addition of this software is said to enhance ease of use and offer process-control capabilities. Real-time, on-screen profiling and profile prediction reportedly save time and labor during setup by allowing profiling to be completed with minimal pa
New Products
Digital Dispenser
The Portion-Aire PV-2000DT series digital dispenser applies any liquid, paste or gel used in the production process. It features an LED countdown timer with two different time ranges: 00.0 to 99.9 sec and 0.00 to 9.99 sec with a membrane switch for upward or downward adjustment. The use of this dispenser allows dispense process verification for ISO certification and provides a repeatable process when the dispenser will apply different materials. The units feature either a 0 to 100 psi or a 0 to
Feature Products
Test Sockets
Yamaichi`s line of Test Contactor sockets are designed for automated or manual testing of BGA, LGA, CSP (with micro miniature balls down to 0.3 mm in diameter), QFP and other gullwing leaded IC packages. The test contactors combine a low profile, small body with long life and good electrical characteristics.
Feature Products
Auto-test Contactor
The HP 95000 auto-test contactor is designed for use with the HP 95000 tester and provides 1 GHz performance with less than 1 ns pulse widths for testing direct rambus DRAM. The contacts feature 0.75 mm pitch, 1.3 to 1.6 nH self inductance, 0.02 to 0.09 capacitance and 9.3 GHz bandwidth at 1.0 dB for accurate test results from -55 to 150°C. The contactor uses a proprietary socket design with interchangeable package inserts that allow the contactor to be refigured for different packages by c
Feature Products
Manual Wafer-bumping System
Motorola Manufacturing Systems has entered the wafer-level CSP arena with the Model SA-20 manual wafer-bumping system. It is said to be capable of depositing 0.010- to 0.012-in. diameter solder spheres onto 6- or 8-in. diameter wafers for interconnect formation. The system reportedly provides cost-effective methods that device and package-development engineers can use to create flip-chip bumps on silicon from development through production stages.
Feature Products
DIP Adapter Modules
DIP Adapter Modules feature 8 to 32 pins for converting an IC that is packaged in a surface mount SOJ, TSOP, PLCC or SOIC package to a pin-compatible direct drop-in replacement for end-of-life DIP ICs. Developed for users with motherboard designs that require DIPs now obsolete, an on-board decoupling capacitor is included. Measuring from 0.400- to 1.6-in. long, depending upon the number of pins, the modules reportedly can incorporate 0.300- to 0.600-in. row-to-row spacing with 0.100-in. lead spa
Feature Products
High-frequency Laminate
The ComClad high-frequency laminate is said to be the first of its kind to combine high- performance antenna capabilities at a lower initial and applied cost. It is suitable for use in microwave and RF segments of the wireless market. Its strength reportedly lies in its ability to combine a low dielectric constant with low-loss factor materials. The laminate consists of Noryl plastic material as the base dielectric, which is said to offer a homogenous dielectric with a dielectric constant of 2.6
Feature Products
Syringe-filling System
The Syringe-filling System repackages material from a large cartridge or reservoir to smaller, manageable syringe packages. It is said to be suitable for companies looking to reduce costs by packaging their own material. To transfer material, an operator loads a full cartridge onto the retainer assembly, then secures it using the universal cartridge cap (with a 90° adapter). An empty plastic syringe can then be screwed on tightly, and a piston is moved into position. Using a foot pedal, th
Feature Products
Test Socket
This socket reportedly uses a proprietary pressure-conductive silicone technology to deliver extremely low inductance and high reliability. In production test, the contact is said to be good for more than 50,000 insertions, has a very low profile (less than 0.5 mm) and is a single-piece contact. Each is individually machined to fit a specific interface. The sockets are available from stock to four weeks.
Feature Products
Illumination Module
The UniversaLight illumination module offers a solution to the problem of imaging ceramic, flex and other substrates. This illumination module, which is available as an option for several models of Universal Instruments` GSM product line, includes a polarizing kit that provides high-contrast images of light-colored ceramic substrates. The one-piece design is said to be easy to mount and adjust. It reportedly also provides flexibility in the areas of illumination wavelength, polarization, and ill
Feature Products
TQFP-to-PGA Adapter
The A14450-1 TQFP-to-PGA adapter converts a 144-lead TQFP with 0.5-mm lead pitch to a standard 15 x 15 PGA footprint. The adapter is routed with a one-to-one interconnect and can be used for prototyping as well as production requirements. It is available in single pieces or in pallet form for high-volume applications.
Feature Products
Ceramic BGA
VIA/BGA is a leadless, thin film, ceramic BGA developed for packaging devices used in broadband data links, transmitting at 10 to 20 Gbps data rates and also for packaging KA-band GaAs MMICs used in broadband wireless access systems, such as LMDS. The package is said to support the new SiGe ICs developed for OC-192 SONET/SDH systems with the capability of extending its range to more than 20 Gbps data rates. It is being adopted in millimeter-wave applications, such as LMDS and SATCOM for broadban
Feature Products
Designers Kit
Seiko Instruments has introduced a Designer`s Kit to ease the design-in process for engineers using its Vitrium G4, a 1/4 VGA LCD developed using chip-on-glass technology. This kit is said to make the design-in process virtually "plug-and-play." It comes assembled and includes the Vitrium G4 display, a white EL backlight, controller board, a COGI bias voltage board, a parallel interface to any PC, a board for mounting all of the components, a software diskette and all connecting cables and hard
Feature Products
Interconnection Interposer
The Chip-Coupler is a molecularly flexible, high-density interconnection interposer technology that differs in material and mechanical construction to the traditional flexible interposer using polyimide film. The technology reportedly eliminates the need and problems of underfill. Comparable interposers of the same interconnection density are said to cost two to three times more than the solution provided with this intrinsically flexible substrate with low-dielectric constant and dissipation.
Feature Products
SOI Wafers
Unibond silicon-on-insulator wafers are produced using commercially available equipment with a proprietary process that uses both ion implantation and wafer bonding technologies. The silicon quality is said to exceed that of standard or low-dose wafers, and the uniformity of the silicon dioxide layer is reportedly better than SOI wafers produced by the bond and etch-stop method. Key advantages include increased power efficiency and reduced power consumption.
Feature Products
Plated Copper on Ceramic
Power Board technology combines the thermal and mechanical features of ceramics with the electrical and thermal advantages of pure copper metalization. Features include plated through-hole capability, copper-plated solid thermal and hermetic vias, plated up copper heat spreaders, good solderability, ability to withstand high temperature die attach and high frequency, good gold and aluminum wire bondability, fine line resolution, and low conductor resistance.
Feature Products
SMD-0.5 Package
The SMD-0.5 package is said to have two times the power-handling capability as the 18-pin leadless chip carrier. Designed to accommodate up to a die size 3, the newproduct reportedly can be used with any RAD-Hard MOSFET, HEXFRED diodes, Schottky or standard HEXFET power MOSFET device. This compact surface mount package comes in at 1.0 g and dimensions of 0.296 x 0.400 x 0.115 in.
Feature Products
Ultra Miniature Ceramic Crystal
The FX532A ultra miniature SMD ceramic crystal measures 5.0 mm x 3.2 mm with a profile of 1.00 mm. It has a frequency range of 14 MHz to 40 MHz, a frequency tolerance of ±100PPM, and an operating temperature range of -10°C to 60°C. Other tolerances and stabilities are available, as are 2,000-piece tape or reel for automatic mounting machines.
Feature Products
FibreChannel Connector
The FibreChannel GBIC Module connector eliminates hand soldering, meets FibreChannel and SCA-2 requirements, has pre-deposited solder and flux on each contact lead, and is available with lead-free technology. The connector is hot pluggable and blind mateable, has a UL 94 V-0 high temperature housing and gold or gold/palladium nickel plated signal contacts and tin or tin/lead plated ground contacts.
Feature Products
DC to DC Converters
The LPD301 series of DC to DC converters is detailed in a new brochure from Powercube. A variety of full-brick footprint converters are available from 50-200 Watts, offer efficiencies up to 90 percent, and provide total isolation of input, output and baseplate, with standard features including over-voltage and over-current protection, thermal shutdown, and frequency synchronization. The converters are available in commercial, industrial and military versions.
New Products
Silver Conductors
The KQ610 is a photoengraveable silver conductor paste that is said to produce ultra-high density interconnections using a combination of screen printing and photoengraving. The material reportedly creates dense fired films with smooth fired finishes that support the production of conductor geometries of 50 µm or better.
New Products
Electric Truck Oven
The No. 817 is a 500°F electric truck oven and is a modified version of the standard TBH-500 truck oven. Portions of the oven that come into contact with the heated air are constructed from Type 304 stainless-steel interior, including supply and return ductwork, the entire heat chamber and the recirculating blower wheel. Workspace dimensions inside the unit measure 48 x 48 x 60 inches high.
New Products
Direct Laser Marking System
The fiber, laser-based 3000 Series Direct Marking System features LaserSmith legend design software designed for marking applications. The unit requires very low power to operate. Reportedly one of the smallest direct laser marking systems in the industry, it can be integrated into an existing system and provide a variety of mark solutions. In testing, the system is said to have performed for more than 500,000 operating hours with zero fiber failures.
New Products
Inspection System
The built-in 2-D inspection system on the DEK 265 and DEK 288 surface mount screen printers reportedly is now able to validate stencil apertures and paste-on-pad for µBGA patterns at a high rate of speed. The inspection system inspects automatically for stencil cleanliness and paste-on-pad to enhance process quality while maintaining rapid cycle times. Patterns for devices with pitches as fine as 0.8 and 0.75 mm may be inspected. A typical µBGA with 48 I/Os in a 6 x 8 matrix requires f
New Products
Inspection/Analysis Software
The Advanced Image Processor is a fully integrated inspection and analysis software package for real-time inspection and failure analysis. It is integrated into most of the company`s X-ray systems and may be used in "interactive" (live-image viewing) or "stand-alone" (previously captured image viewing) modes. The software is suitable for inspection and verification of boards using BGAs, flip chips, µBGAs and other high density packages.
New Products
Cleaning Systems
Systronic`s Stencil/Screen/PCB Cleaning Systems are pneumatic-operated, stand-alone and self-contained cleaning systems that reportedly do not require electricity or water in-feed connection. The system is designed for solvent-based as well as water-based room-temperature cleaning processes. The cleaning cycle consists of three stages: wash, rinse and dry, to clean and dry the product.
New Products
Wafer/Die Defect Inspection
The NSX-100 is a new addition to the NSX series of automated micro defect inspection systems for wafer and die. It is said to offer an improvement in inspection time of up to 100 percent compared with previous industry standards. With high resolution image capturing technology and enhanced illumination techniques and optics, inspection time in a typical 8-inch wafer application reportedly can be cut from 120 to 60 sec.
New Products
Transport/Handling Solution
Fluoroware has launched the patent-pending JEDEC Style Waffle Pack Tray-in-Tray for chip scale packaging and wafer level packaging applications. This transport and handling solution allows waffle packs of varying pocket sizes to be used in conjunction with a JEDEC-compliant tray during assembly and test, which eliminates the need for tray retooling. The tray-in-tray solution consists of the company`s waffle pack trays, which are placed inside a JEDEC-compliant tray, allowing for interface with e
New Products
High Speed Robot
New to Toshiba Machine`s line of HSP series Scara robots is the SR-424HSP. With a total arm length of 420 mm, the robot can work within an area the size of a pallet. By bringing four-axis, multitasking capability and 32-bit control to a robot with an arm height of 479 mm and a weight of 21 kg, this pick-and-place solution can help reduce the overall size of a variety of machines. This robot is said to be fast and accurate, offering rotational speeds of up to 480°/sec and repeatability accur
Editorial
Letter to the Editor
I was pleased to see the results of the Third Annual Semi Dice Inc. Bare Die Survey featured in the pages of the November/December issue of your magazine ("CSP No Match for Bare Die"). I want to clarify the results on the survey as they relate to Chip Scale Packaging. CSP is certainly a viable packaging option and has a bright future. The survey results clearly indicate that CSPs will have little impact on the Bare Die Market.
Notes From The Floor
Semiconductor slowdown is imminent
Although you are reading this column in the March issue of Advanced Packaging, it was written in January, which is, coincidentally, the time of year when set my annual forecast. Actually, I started my forecasting research for 2000 in the fourth quarter of 1999 (4Q99), but I didn`t really solidify it until the first week or two of January. I only hope that it reaches you in time for you to have a chance to revise your forecast for the 2000 calendar year.
Notes From The Field
Package or surface mount assembly?
A client recently posed the question, "Can you help us to define the difference between semiconductor packaging and surface mount assemblies?" "It`s obvious," you say? "Semiconductor packaging deals with bare die and surface mount assembly uses only packaged devices." But upon further consideration, the problem becomes far more complex and depends greatly on the perspective taken. Technically speaking, where would thick and thin film hybrids belong? And multi-layer ceramics? And how about multi-
News
Kyocera purchases VisPro
Kyocera America Inc., a packaging solutions designer, manufacturer and assembler, has purchased VisPro Corp., a supplier of LTCC multilayer ceramic substrates and structural ceramic components. VisPro is now a new division of Kyocera, and the division`s 60 employees will continue to operate out of its Beaverton, Ore. facility.
News
Ceramic industry roadmap
The International Microelectronics and Packaging Society (IMAPS) will introduce an updated ceramic industry roadmap in March. The roadmap demonstrates the competitive advantages of ceramic technologies and their potential uses in the design, development, manufacturing and marketing of microelectronics applications over the next decade. For more information, visit the IMAPS Web site at www.imaps.org or call 1-888-GO-IMAPS.
News
FCT signs flip chip license
Flip Chip Technologies (FCT) LLC, a joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, has signed a 10-year technology transfer agreement with Siliconware Precision Industries Co. Ltd. (SPIL). SPIL will use FCT`s proprietary flex-on-cap wafer bumping and redistribution technologies to manufacture advanced flip chip packages at its Taichung, Taiwan, assembly facility.
News
ABI forecasts wireless to grow by billions
The market for wireless power products, including gallium arsenide (GaAs) integrated circuits (ICs) and transistors, and silicon power modules and transistors, will grow from $1.7 billion in 1999 to $5 billion in 2004, according to a recent study by Allied Business Intelligence (ABI). According to ABI, "Early growth will be driven by the use of GaAs IC power amplifiers in the fast-paced cellular/PCS handset market. Wireless broadband strategies, such as local multipoint distribution systems (LMD
News
Applied Materials buys Etec in $1.8 billion stock deal
Applied Materials Inc., the world`s largest maker of semiconductor manufacturing equipment, announced that it would buy Etec Systems Inc. in a stock deal currently valued at approximately $1.8 billion. Etec, based in Hayward, Calif., develops technology to make masks, which are used to print circuitry patterns onto silicon wafers. Each share of Etec`s stock will be exchanged for 0.649 shares of Applied Materials` common stock; the acquisition will be accounted for as a pooling of interests and i
News
Call for papers on lead solder alternatives
PORTSMOUTH, R.I. - The Military and Aerospace Electronics Committee of the ASME Electrical and Electronic Packaging Division has announced a workshop on the use of lead solder alternatives in military electronics. The workshop will be held during the 2000 International Mechanical Engineering Congress and Exposition, November 5-10, at the Walt Disney World Dolphin Resort. Papers are requested to discuss or present concerns, issues or work addressing this topic. Suggested technical topics include:
News
SAL Inc., South Burlington, Vt., has appointed Dan Fleming to president and chief executive officer.
News
DSM Engineering Plastics, Evansville, Ind., has named Roeland H. Polet vice president of marketing and sales.
News
Laser Fare Inc., Smithfield, R.I., has appointed Joseph J. Reddy to vice president of operations.
News
Mydata Automation Worldwide has appointed Pierre Martin to president of Mydata Japan, Joel Girard to managing director of Mydata France and Cheng Chong Foo to managing director of Mydata Asia.
News
Ultron Systems Inc., Moorpark, Calif., has expanded into a facility four times the size of its previous one.
News
Electro-Science Laboratories, King of Prussia, Pa., has made the purchase of thick film materials available on-line at www.ElectroScience.com.
News
ChipPAC Inc., Santa Clara, Calif., has received SAC Level 1 certification for its Korea facility.
News
Aegis Industrial Software, Philadelphia, Pa., has received certification from Siemens Energy and Automation Inc. for its CircuitCAM Version 4.1.2.6 computer integrated manufacturing software.
Editorial
Ready, set...write!
In the short time I have worked for Advanced Packaging magazine, I have received many phone calls from potential authors who want to write for the magazine. Wonderful! Our best articles tend to come directly from those immersed in the industry, so these inquiries are always welcome. We are always looking for insightful articles that will help our readers better understand this industry - in effect, helping people connect the dots so everyone can excel in their jobs.
Automotive Perspective
Flip chip soldering flux: Clean or no-clean processing?
Flux is an interesting substance that has a long history. Its use can be traced back to the Bronze Age when brazing was developed to make weapons and jewelry. Commonly used rosin flux, in its natural form, is the "life blood" or sap of an evergreen tree. Today`s sophisticated synthetic fluxes are formulated from base chemicals. Flux enhances the bonding of similar or dissimilar metal surfaces during the soldering process; this enhancement is achieved by the flux chemically breaking down oxides o
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