Table of Contents
Solid State Technology
Year 2000
Issue 2
 | DEPARTMENTS
Feature Products
Acoustic Scanner
The Model D-24 C-SAM scans large populated boards up to 24 x 24≤ and acoustically images component delaminations, cracks and voids in either of two modes. Single-scan mode scans the entire board when all components are the same height; multiple-scan mode scans mixed components individually.
Feature Products
Turn Key Laser Marking System
The PCM6800 marking system eliminates the cost of paper labels. It handles standard board sizes up to 500 mm x 500 mm and can mark any combination of text, barcodes or 2D cell codes. This platform features a SMEMA compatible PCB conveyor and can be installed on an automated assembly line or used as a stand-alone station. Options include variable Y-axis field positioning, multiple board stops, fume/exhaust removal and a visible laser pointer.
Feature Products
Pick and Place System
The MicroStage multi-axis system is suitable for many component manufacturing applications, including assembly and test. The system is Class 10 clean room certified, and it is composed of linear positioning stages that provide backlash-free low friction rolling motion without sacrificing load capacity or smoothness. Manufactured from aluminum, these low mass systems are available in a variety of stroke lengths, sizes and lead screw arrangements to accommodate various speeds, orientations and loa
Feature Products
Robot
The Selective Compliance Assembly Robot Arm TMB100 series features a two-piece arm with joints that allow it to move horizontally and rotate independently. The robot can cover a large working area with a small installation area and can be used in dispensing, soldering, screw tightening, pick and place, and general purpose applications. The product features repeatability within 0.01 mm, safe operation via area sensor and interlock capability, a memory card that stores up to 100 programs or 4,000
Feature Products
Hot Air Leveling Tape
Scapa 657 is a tough masking tape for protecting gold or rhodium finger contacts during hot air leveling and wave soldering processes. With durability and low static characteristics, the product is a specially treated paper laminated to a polyester film and coated with a silicone adhesive that allows the tape to withstand temperatures of nearly 500∞F without leaking. The product protects finger connectors against chemical solvents, solder and rinse water; detaches from the substrate withou
Feature Products
Rework System
The Sniper II is an extension of the Sniper Split Vision BGA/CSP and QFP rework system and includes a multiple profile storage system for data logging, and automatic loading and storage of rework temperature profiles. This low-temperature convection rework technology is enhanced with 16 multiple segment profile patterns and can be operated without a computer.
Feature Products
Moisture Barrier Bags
Statshield EMI/RFI High Moisture Barrier Bags provide a dry ESD-protected package for ESDS devices. The moisture transmission rate is < 0.005 gr, and the 6.5 mil thickness offers over 30 pounds of puncture resistance. Static dissipative properties comply with EIA-583-1 and available sizes range from 4 x 6≤ to 18 x 24≤. Desiccant and humidity indicator cards are available.
Feature Products
SMT Assembly System
The MP 1260 series SMT assembly systems feature continued operation while changing components or jobs and may be configured with up to 328 feed locations, and up to 10 flexible vacuum placement heads, gripper and dispense heads. The systems handle parts from 0201 to 55 mm2. Its vision system and ability to simultaneously pick up to five components allow for placement rates up to 5,000 CPH.
Feature Products
Stress Test System
The Accelerated Stress Test system can demonstrate in hours how a product will hold up after years of use. The system applies environmental stresses that accelerate product fatigue and expose defects that surface over time under normal conditions. Extreme stresses are imparted to products under test through ultra-high rates of temperature change in excess of 70∞C/min and multi-aces, repetitive shock vibration capable of producing acceleration forces over 50 g.
Feature Products
Machine Vision Engine
Based on the Windows CE operating system for embedded control applications, NetSight provides users with a fully programmable, mmx scaleable, high-performance and deterministic extension (or alternative) to host-based vision procession. Configurable with self-boot or remote-boot capability, the product can be used as a stand alone or network-ready device. In its self-contained, small footprint, OEM-style enclosure with 16-bit digital I/O for monitoring and controlling discrete processes, the pro
Industry Voices
Test methodologies and systems require paradigm shift
Leading semiconductor manufacturers argue that the cost of test is the single greatest contributor to the total cost of bringing an integrated circuit (IC) to market. If this is true, this plays a critical role in the success and profitability of newly emerging system-on-chip (SOC) technology. Semiconductor manufacturers hope to keep the cost of test and time-to-market for SOC development in line with today`s application-specific integrated circuit (ASIC) devices; this may prove to be a daunting
Feature Products
Reworkable Flip Chip Underfills
Loctite 3567 is an epoxy-based liquid underfill compatible with polyimide-passivated flip chip, CSP and BGA assemblies. The product allows a flip chip to be replaced after testing determines that the chip is defective; packages can be removed by heating the package and the underfill for one minute at 210 to 220∞C, where the epoxy will begin to decompose. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165∞C, is easy to dispense and quickly penetrates gaps
Feature Products
Moisture Protection Technology
2AP, a technology that combines desiccant with injection-molded plastic, can increase yield by reducing moisture contamination to wafers and finished semiconductors in front- and back-end handling applications. The product can reduce particle emissions and can be used as a polymer substitute for waffle trays, quad mount frames and IC handling trays.
Feature Products
Rework and Reballing Station
The M-7500 provides pad cleaning, paste/adhesive dispensing, removal and remounting of all types of ICs, PLCCs and QFPs. Kits can be purchased to add BGA, µBGA and CSP rework and reballing capabilities. The station has built-in profile storage and large/odd board capacity.
Feature Products
Flux Residue Cleaner
Vigon RC 100 cleans flux residues from reflow ovens and wave solder machines. The product is water-based and non-flammable with an HMIS rating of 0-0-0. It is used undiluted on either hot or cold surfaces, does not contain halogenated compounds and is biodegradable. The cleaner is applied with a hand spray bottle and dirt is wiped away with a cloth.
Feature Products
Assembly Tweezers
The SofTweezer line of soft-cushion grip tweezers is both ESD and clean room safe. Lightweight and ergonomically designed to reduce fatigue, eight different styles provide a range of grasping, holding and cutting capabilities for restricted spaces and repetitive cycles. The tweezers are made of anti-magnetic, acid-resistant stainless steel with wide foam cushion grips to reduce strain.
Feature Products
Functional Test System
GR Versa features a 21-slot 6U, PXI/CompactPCI backplane and PXIscan modular signal switching architecture. The software driver automates the switching process. The complete system offers a standardized hardware platform, instrumentation and switching modules, configured for specific test requirements.
Feature Products
Manufacturing Services
Lockheed Martin provides design, procurement, manufacturing and logistic support. Products produced are high-quality, reliable, ruggedized computers and peripherals; RF communications equipment; postal mail/package handling equipment; and large-scale systems, including COTS integration. Capabilities include CCA/PTH/SMT/BGA assembly and test. Full ISO/MIL/SEI level 4 qualified.
Feature Products
Smart Camera
The VC38 industrial smart camera is a complete vision system that measures 100 x 50 x 36 mm and weighs 250 mg. The product features a Sony 1/3 inch progressive scan sensor that provides a pixel resolution of 640 (H) x 480 (V), an analog devices digital signal processor, 8 MB of SDRAM and 2 MB of non-volatile flash EPROM. The camera also offers optically isolated industrial I/O, an RS-232 serial port, pixel-identical sensor readout and a video output signal that can be displayed on any standard V
Feature Products
Wafer Bump Reflow System
The new multi-belt continuous conduction wafer bump reflow system provides highly controlled and repeatable reflow profiles. Wafers are heated by conduction from a conveyor belt in the heating zones with subsequent transfer to an independent cool belt in the cooling zones. This low particulate environment can maintain an atmosphere at less than 5 ppm 02.
Feature Products
Component Placement Cell
The 3500-II is a fully automatic, high-accuracy die bonder capable of performing automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4-sided perimeter collets. Using look-up and look-down cameras for flip chip applications and "relative-to" referencing for linear micro-strip line placement, the 3500-II yields accuracies of ±0.5 mil.
Feature Products
One-piece Interface
One-piece interfaces on 1 mm pitch are available with a choice of board spacing, including 1.64 mm, 2.00 mm, 5.8 mm and 9.9 mm. Beryllium copper and phosphor bronze contacts provide high normal forces and a large contact deflection. Options include five-position single-row designs and double-row designs with up to 50 positions per row. These interconnects are available with standard SAE and metric threaded hold-down hardware, and optional alignment pins can be specified to position on the solder
Feature Products
Automatic Wedge Wirebonder
The H&K Bonjet 710`s open design allows for a bond area of 7.4≤ x 7.0≤, a variety of indexing systems and integration with other equipment. Other features include a high-frequency ultrasonic transducer of 100 kHz, the ability to use both gold and aluminum wire, and graphical representation of wire deformation. The product is suited for COB, hybrid, MCM, sensor and smart card applications.
Feature Products
Dispensing System
The M-2000 dispensing system is suited for high-volume, production-critical packaging applications, including flip chip underfill, cavity fill, and dam and fill. The product features a DP-3000 series linear pump for increased closed loop control and better than 1 percent, 3 sigma dispensing accuracy. The platform includes mass flow calibration, software-managed temperature control, advanced lighting systems, and operating software for easy set-up and system control.
New Products
Electroplating Technology
Through the use of patented electroplating technology, Unitive Electronics has announced the ability to produce a wide array of bump sizes and pitches for wafer bumping. Bumps ranging from 20 to 800 µms reportedly can be generated, with densities as high as 20 µm bumps on a 50 µm pitch. The process is based on patented Intermetallic Compound Patterning wafer bumping technology, which uses certain metals in the under-bump metallurgy to form intermetallic compounds with liquid solde
Feature Products
Module Tester
The M-2 Memory Test System is available with signal drivers and easy-to-use software. It allows testing of multiple PC 100/133, DDR or RAMBUS modules in parallel. The test socket board accommodates various package and device types. Hardware features include microsequence, address, data, select and control generators; pin driver; address and data scrambler memory; real-time error logging; programmable power supplies; DC parametric units; and test socket boards. Software for the M-2 runs on the Wi
Feature Products
BGA to BGA Adapters
These adapters can be used to convert difficult-to-assemble fine pitch BGAs to footprints that are compatible with standard manufacturing processes. They can also be used to isolate fine pitch, high-performance components from the motherboard to keep the motherboard layer count to a minimum. This product line is available from stock, and custom adapters are also available.
Feature Products
High Barrier Bags
Ultra Clear High Barrier Bags offer maximum optical clarity and moisture vapor protection. The product is humidity independent with a surface resistance of < 1012 ohms. Electrical properties will not wear off and multi-layer construction, with a thickness of 4.0 mils, provides high puncture resistance.
Feature Products
Multi-use Bonder
The Model 860 Omni bonder can be configured to bond flip chips, laser diodes and eutectic bonded die. The joystick-controlled system aligns and attaches die sizes from 0.006≤ square to 1≤ square at throughput rates of up to 200 placements per hour with placement accuracy of ± 5 microns. Standard features include an extend-retract cube beam splitter viewing system with illuminators and precision servo motor-driven Z motion with closed loop temperature control. A rapid heat-up sta
New Products
Autorouter
The BGA Route Wizard is an autorouter for PADS Software`s PowerBGA solution for advanced package design. A wizard-based automatic router for single die advanced packages, it is designed to serve as a cost-effective tool for solving package routing problems. The machine reportedly enables an engineer to quickly determine package feasibility based on the die and a set of technology rules. Once feasibility is established, the same tool completes the design with automatic routing optimized to manufa
News
DEK USA Inc., Flemington, N.J., has received the Partners in Performance award from Celestica Inc.DEK USA Inc., Flemington, N.J., has received the Partners in Performance award from Celestica Inc.
News
The Dii Group, Niwot, Colo., has announced that Dovatron, its electronics assembly subsidiary, has broken ground for a 40-acre manufacturing campus in Guadalajara, Mexico.
News
Dense-Pac Microsystems Inc., Garden Grove, Calif., has signed a manufacturing license agreement with Seagate Technology Inc.
Dense-Pac Microsystems Inc., Garden Grove, Calif., has signed a manufacturing license agreement with Seagate Technology Inc. for the use of Dense-Pac Microsystems` high-density, three-dimensional technology in Seagate disc drives.
News
ON Semiconductor, Phoenix, Ariz., opened a facility in Piestany, Slovakia, where full production of metal-gate CMOS logic devices will begin in the first quarter of 2000.
Editorial
Tackling 2000 and Beyond
During the past few months, there has been a spirit of regeneration throughout the world, as many eagerly anticipated the calendar year rolling over to 2000. Regardless of which stance you took regarding the true start of the third millennium, the result of last New Year`s still tends to be the same: From individuals to entire companies, everyone is talking about doing something new. Many tackled weighty resolutions this year like none other, while others just analyzed how to better accomplish t
Notes From The Floor
Lead-free ... Are You Ready?
Word has it that a prominent Silicon Valley-based semiconductor company president decreed to his packaging group that Japan`s requirement on lead-free electronic assemblies and the elimination of lead from the external solder on an integrated circuit (IC) package by the first quarter of 2001 (1Q01) will not be an impediment to his company`s shipment into Japan. In other words, "Packaging engineering, don`t let lead-free be another obstacle between Japan and U.S. trade; make sure you have a fix!"
News
Wastewater recycling system addresses environmental concerns
NEWBURY, OHIO -The STMicroelectronics (Phoenix, Ariz.) wafer fab has begun operation of an integrated wastewater recycling system designed and built by Kinetico Inc. (Newbury, Ohio). The system uses propritary recycling technology and is believed to be the first integrated water recycling system installed in the U.S. semiconductor industry for chemical mechanical planarization (CMP), metal, oxide and backgrinding process wastewater.
News
SEMI applauds Chinas entry into the WTO
WASHINGTON, D.C. - The United States and the People`s Republic of China have reached an agreement on terms governing China`s entry into the World Trade Organization (WTO). Under the reported terms of the accession package, China will participate in the Information Technology Agreement (ITA), eliminating tariffs on a number of high technology products, including semiconductor manufacturing equipment, by 2005. The agreement would also establish trading distribution rights and other rules on the tr
News
Tosoh SMD, Grove City, Ohio, has appointed Robert Cross to product support specialist.
News
William Stone has been promoted to president of Temptronic Corp., Newton, Mass.
News
Quad Systems Corp., Willow Grove, Pa., has appointed Elmer OBrien to vice president of technical services and support, Matt Stackhouse to senior director of technical services,
Quad Systems Corp., Willow Grove, Pa., has appointed Elmer O`Brien to vice president of technical services and support, Matt Stackhouse to senior director of technical services, and Edward Conson to Eastern region (U.S.) service manager.
News
Santa Clara, Calif.-based ChipPac Inc. appointed Robert Krakauer to chief financial officer.
News
Electro Scientific Industries Inc., Portland, Ore., announced the retirement of company founder Douglas C. Strain from his position as vice chairman of the board of directors.
News
National Technical Systems Inc., Calabasas, Calif., has named Martin M. Dresser as marketing director for com- puter software/hardware testing.
News
The International Microelectronics and Packaging Society award selection committee has chosen Lee R. Levine, principal metallurgical engineer with Kulicke & Soffa Industries Inc.,
The International Microelectronics and Packaging Society award selection committee has chosen Lee R. Levine, principal metallurgical engineer with Kulicke & Soffa Industries Inc., to receive the John A. Wagnon Technical Achievement Award.
News
BMI Corporate Inc., Palatine, Ill., has named the following individuals to the board of directors:
BMI Corporate Inc., Palatine, Ill., has named the following individuals to the board of directors: Mel Boldt, Jim Bernhart, John Canning, Patricia Marshall and Richard Smith.
News
Ekra America, Marlborough, Mass., has appointed Steve Hall as general manager and Jim Bernhard as vice president of sales and service.
News
Chaska, Minn.-based Entegris Inc. has promoted T. Weldon Smith to senior vice president of test, assembly and packaging business.
News
Trace Laboratories, Palatine, Ill., has completed a 3-meter semi-anechoic RF test chamber and a shielded control room at its newly renovated 27,000-square-foot electromagnetic compatibility facility.
News
American Microsystems Inc., Pocatello, Idaho, has opened a mixed-signal and analog design center near Salt Lake City, Utah.
News
Pilgrim ESD Technologies, Sea Cliff, N.Y., has been acquired by Desco Industries Inc., Chino, Calif.
News
Mitsui Chemicals, Purchase, N.Y., has launched its Web site at www.mitsuichemicals.com.
News
Toronto, Ontario-based Luxell Technologies Inc. has completed the initial phase of a $3 million expansion program that will double its annual flat panel display manufacturing capacity.
Toronto, Ontario-based Luxell Technologies Inc. has completed the initial phase of a $3 million expansion program that will double its annual flat panel display manufacturing capacity. The expansion is scheduled for completion in the third quarter of 2000.
News
El Segundo, Calif.-based International Rectifier has opened a facility in Swansea, Wales,
El Segundo, Calif.-based International Rectifier has opened a facility in Swansea, Wales, where power semiconductors and related components are assembled into proprietary motion control modules.
New Products
Wavesoldering Machine
Vectra is Electrovert`s newest addition to its group of wavesoldering machines. It is designed for board manufacturers with production environments that demand fast changeover, process flexibility, system reliability and easy maintenance. The machine is said to integrate proven technology and processing capabilities with new standard features, additional options and enhanced data acquisition software. It uses a Windows NT operating system and allows operator multitasking. It also has a new inter
New Products
Laser Marking System
The LM45 Laser Marking System consists of the LM45 Q-switched Nd:YAG laser marker integrated with an ergonomically designed MW workstation. The new system is designed to offer fast and flexible noncontact marking with accuracy and quality. Using high speed X-Y galvanometers, the laser beam is directed to the work surface through a flat field lens, producing a 5" square marking area. Laser spot diameters as small as 0.003" are said to produce clean, crisp high contrast marks over the marking area
New Products
Plastics Overmolding Process
The Matrix proprietary overmolding process fully encapsulates delicate sensitive electronic components using high temperature-resistant resins, such as PBT and high flow nylons. Featuring close tolerance overmolding, this process is said to eliminate costly, time-consuming potting/curing steps and other secondary operations. Reportedly capable of producing components ranging in size from 0.090 x 0.090 x 0.200" up to 9.00 x 9.00 x 1.00", the process can achieve tolerances of 0.0002", depending up
New Products
Signal Access Tool
A complete adapter debug support for the 466 MHz Intel Celeron Processor in the 370-pin socketed plastic pin grid array is now available. The adapter is said to provide design engineers with signal access at the chip level, enabling software integration and debugging capabilities. It is also designed to provide a hook-up from the processor to a logic analyzer or oscilloscope. This tool was created in response to Intel`s announcement to ship the Celeron solely as a 370-pin socketed plastic PGA.
New Products
UV Cure Adhesive
The Ablelux AA50 UV/visible blue light curable adhesive is for quick fixturing LED and laser light sources during the active alignment of transceiver package assemblies. Bonding is reportedly achieved in seconds. It is said to be a high-Tg, low-shrinkage material with adhesion to gold.
News
Raychem launches Web site
Raychem Corp. introduced a new Web site dedicated to its gel products. Located at http://gels.raychem.com, the site enables design engineers and buyers to locate product information, technical and performance data, and tips on identifying the gels to best meet application needs. The site offers visitors a product selector, the ability to view, download and request information, and a search function to locate distributors and representatives.
News
August Technology ranked tenth fastest in growth
Edina, Minn.-based August Technology, a worldwide supplier of automated, 100 percent micro-defect inspection equipment to the semiconductor industry, has been given a "Minnesota Technology Fast 50" award as the tenth fastest growing technology company in Minnesota, based on revenue growth. From 1994 to 1998, the company enjoyed an increase in revenue of 895 percent.
News
MeltroniX to build for high-bandwidth-access markets
San Diego, Calif.-based Microelectronic Packaging Inc. has changed its name to MeltroniX Inc. and has a new focus in microelectronic design, volume manufacturing and test services on wireless/telecom and internet equipment companies that serve high-bandwidth-access markets associated with e-commerce. Because the company discontinued its ceramic package operations in Singapore, it was felt that the previous name did not accurately reflect its current business.
News
Flash memory partnership
InterWorks Computer Products, a provider of modular solutions to telecom, internetworking and embedded subsystems, has formed a strategic partnership with Houston`s BP Microsystems. The latter firm, which markets a range of engineering and production device programmers, will work with InterWorks to augment its flash memory support services in the areas of programming, test and verification.
News
Static-control info now on web
Hatfield, Pa.-based Chapman-SIMCO has launched a new Web site containing data on static elimination, electrostatic charging and web cleaning at www.chapman-static.com. The site also includes information on how charges occur, methods of static elimination/charging for electrostatic bonding and a general positioning guide for control devices.
News
ASAT offers thermal addition to IC package design software
Fremont, Calif.-based ASAT will assist Fluent Inc. in building integrated circuit macros in Fluent`s thermal management Icepak software. The tool enables designers to define the characteristics of the package so that it can be represented in a computer model. A variety of IC package thermal models using JEDEC standards will be used to guide the development of the macros at Fluent.
News
DARPA commissions PPI for laser tool
Lanham, Md.-based Potomac Photonics Inc. is in receipt of a $7.5 million contract from the Defense Advanced Research Projects Agency to develop a laser-based tool for fabrication of the next-generation of resistors and capacitors. The overall goal is a commercially available machine able to produce mesoscale electronic devices in a conformal manner on virtually any substrate.
News
Tru-Si tackles problems of chip-to-chip vertical interconnection
SUNNYVALE, CALIF. - Tru-Si Technologies Inc., a leader in atmospheric downstream plas- ma (ADP) processing for vertical miniaturization solutions, has announced a breakthrough overcoming the challenges that threaten Moore`s Law. Using its ADP etching process, the company has discovered a method of successfully stacking multiple chips by stacking wafers containing dif- ferent circuit functions, such as memory, logic, analog and digital. This technology, which maintains the economies of scale inhe
News
PennWell acquires Advanced Packaging
LIBERTYVILLE, ILL. - PennWell, a diversified media company with magazines, trade shows and conferences in more than 40 markets worldwide, has acquired Advanced Packaging and four other magazine titles (SMT, Connector Specifier, Vacuum & Thinfilm and SMT International) from Libertyville, Ill.-based IHS Publishing Group.
News
NEPCON West offers new TAC line
NORWALK, CONN. - An all-new Technology Advancement Center (TAC) line, an expanded technical conference and many special events are among the highlights of NEPCON West 2000, which will be held at the Convention Center in Anaheim, Calif. More than 700 companies will exhibit, representing all sectors of electronics manufacturing from design through test.
News
SIA forecasts 21% growth in 2000, 20% in 2001
SAN JOSE, CALIF. - The Semiconductor Industry Association (SIA) has recently announced its predictions for industry growth. SIA forecasts that 2000-2001 growth rates will exceed 20 percent, part of a strong surge in growth overall from 1999-2002. The trade group predicts that the worldwide semiconductor industry will grow 15 percent with sales topping $144 billion in 1999, marking the first sustained period of growth since 1995. Sales are expected to surge 21 percent to $174 billion in 2000. Con
Automotive Perspective
Underfill: what designers applaud and manufacturers tolerate
Flip chip underfill is the enabling process for flip chip interconnect survival on printed circuit boards (PCB). Its function: to distribute shear stress normally placed on the solder bumps. Stress is a product of the dissimilar coefficients of thermal expansion between the silicon integrated circuit and the laminate. Also, underfill enables the use of larger flip chip die on ceramic substrates, which historically feature smaller flip chips assembled with only compliant solder bumps to absorb co
News
SEMATECH offers new methodology
The SEMATECH reliability technology advisory board developed a reliability evaluation test methodology to keep pace with market trends. The "Use Condition Methodology" is based on conditions in which the semiconductor package will be used. Detailed process steps are described for suppliers to establish the reliability stress program and evaluate all encountered failure mechanisms. This methodology requires extensive knowledge of the physics of failure mechanisms and the anticipated use of the co
News
Photon to acquire CR Technology
An agreement for Photon Dynamics Inc. to purchase CR Technology is intended to expand Photon`s geographic presence and leverage its technology into new markets. Photon is a provider of inspection and test equipment for the flat panel display industry, and CR Technology manufactures X-ray and optical inspection systems. The acquisition is expected to increase Photon`s inspection capability and ensure defect-free bonding to glass substrates.
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