Issue

Document management software enables colleagues and business partners to collaborate around the world and around the clock.

The "Couples Only" Cruise had 1,100 married couples as passengers. Four-fifths of the husbands who were taller than their wives were also older. Five-sixths of the husbands who were older than their wives were also taller

Toshiba America Electronic Components Inc. has expanded its lineup of medium-power packaging solutions to include US-Flat, S-Flat, M-Flat, thin flat package (TFP) and VS-6 devices

"As a young engineer, I learned as much from traveling as I did while a student in a classroom."

Paul Lin has joined Kulicke & Soffa (Willow Grove, Pa.) as director of process integration

Third lead-free summit offers new data

If you want to see the future of packaging, check out "Brain-Implantable Biomimetic Electronics as the Next Era in Neural Prosthetics" in the July 2001 issue of Proceedings of the IEEE

Abletherm 3100 is a new family of advanced thermal interface materials for high-performance, flip chip BGA packages

Kyocera America Inc. has introduced the industry's first flip chip build-up substrate that is capable of withstanding 260?C solder reflow, which is necessary for lead-free processing

Evaluation of new flame retardants

Providing high density and performance for chip-to-system interconnection

Die separation of thin silicon wafers and delicate III-V substrates creates challenges for traditional saw dicing

Meeting performance and reliability standards