Issue

Wafer bumping is replacing wire bonding as the interconnection of choice for a growing number of components

Emerging technologies in bumped interconnections

SECAP is making progress on the many challenges

Photodefinable polyimide addresses packaging challenges

The extent of the commercial marketplace for high-frequency devices requires high-quality, high-volume ribbon bonding. The ability to automatically bond ribbon wire with consistency is important for producing the required electrical and mechanical performance

Advances in automating first-level interconnection of optoelectronic components are essential to reducing costs in the optical network

Novellus Systems Inc. (San Jose, Calif.) has promoted Peter R. Hanley to company president. Hanley will also join chairman of the board and chief executive officer Richard S. Hill in a newly created office of the chief executive officer

Semitool (Kalispell, Mont.) has received a patent for copper seed layer enhancement, an advancement in technology that will help semiconductor device manufacturers achieve high-performance devices and smaller chips from copper interconnect-based semiconductor devices

Tessera and Intel make strides in stacked chip technology

Al, the youngest of six seniors (Al, Ben, Cam, David, Ezra and Fred), announced, "For each of us, I have calculated our average age before and then after including each of our ages. Fred's age is 50-percent higher than mine

The past few months have been a disaster for most in the packaging world. Factory run rates are way down, and sales forecasts are dismal

This issue of Advanced Packaging magazine will hit readers' desks just before the industry's premier event - SEMICON West 2001.

When we look back on 2001, we will likely remember it as the year that the long-heralded convergence of packaging and wafer fab processes really turned the corner, with convincing advances on many fronts

Perhaps the trendiest topic in the electronics industry is how we're going to reinvent the "smaller, faster, cheaper" paradigm to incorporate "environmentally responsible."