Issue

The demand for high-performance, high-density semiconductor assemblies continually pushes materials suppliers and packaging engineers to develop enhanced integrated circuit (IC) package designs

Critical plasma processing parameters for improved strength of wire bonds

LCoS manufacturing incorporates both traditional and novel packaging methods

In the microelectronics industry, reliability of a package is usually assessed by the integrity of its solder joints. Tin-lead eutectic and near-eutectic solder alloys are the most commonly used bonding materials in electronic packaging, providing electrical and thermal interconnection, as well as mechanical support

Cathy was driving her daughter, Kathy, to the Advanced Packaging May Day party. Cathy planned to be there 15 minutes early (to straighten the ribbons in Kathy's hair) by driving 60 mph on the highway and 30 mph on the 20-mile stretch of side road.

During the past few years, stock options have become an increasingly popular component in nego tiating employment packages. For attracting new employees, retaining current employees, and encouraging company longevity and loyalty, stock options have been key

The Model 410 flip chip bonder can now be ordered equipped with thermosonic bonding capability that satisfies a range of applications, including small microwave and optical devices, and large devices with substantial bump counts requiring high bond loads

Asymtek (Carlsbad, Calif.) has named Bill Donges product manager of conformal coatings, David Canny technical process manager, and Joe Curran technical support manager for western North America

Finally, the summer months are upon us. Oftentimes, this can translate into less business travel, as trade shows wind down (revving up for the big SEMICON West show, I suppose) and there are fewer conferences

In a response to industry demand for lead-free products and, more specifically, to customer projections to implement lead-free processes, LSI Logic Corp. has introduced a set of lead-free ball grid arrays (BGAs) for use in communication and storage products