Table of Contents
Solid State Technology
Year 2001 Issue 1
| FEATURES
Step By Step Step 1: The back-end process
During the past 30 years, dicing systems and blades have been continuously improved to address process challenges and accommodate the requirements of different types of substrates
Improving Flip Chip Manu Improving flip-chip manufacturing through proper cleaning
Incorporating cleaning into the manufacturing process can increase throughput, performance and yield
Challenges And Trends In Challenges and trends in back-end inspection and tray-to-tape packaging
Emphasis has shifted from upstream processes to optimization of back-end operations for BGA packages
Csp Devices On Printed W CSP devices on printed wiring boards
Second-level reliability characterization using temperature cycling
|
DEPARTMENTS
News Motorola innovates packaging with new strategies
Motorola Semiconductor Products Sector (SPS) is the strong, silent type. The industry might characterize the company as having been elusive in terms of its packaging developments in recent years, but behind this silence comes some good news for the packaging arena
News Movers and shakers
Ferro Electronic Materials, a division of Ferro Corp., Vista, Calif., appointed Robert S. Hodder, Jr. as North American sales manager, East region
News Briefly speaking
Advanced Interconnect Technologies (AIT) now offers a new Web site at www.aitsales.com. The site includes company and product information, reports and data sheets, assembly and test capabilities
News Advanced Packaging launches Asia edition
NASHUA, N.H., AND Taipei, TAIWAN - PennWell Publishing and Arco Publishing have recently launched a Chinese/English language edition of Advanced Packaging magazine
Product Roundups APEX Product Preview
The second annual IPC SMEMA Council Electronics Assembly Process Exhibition and Conference (APEX) will be held at the San Diego Convention Center, January 14-18, 2001
Think Tank Alice and Her Daughters
One day recently, out of the blue, my sister Alice made this remark about her three daughters and herself
Notes From The Floor Market outlook 2001
There are a variety of factors indicating that 2001 could be an interesting year for forecasting. PC sales are down and so is the communications market
Industry Voices Breaking the solder barrier
As the electronics manufacturing industry moves into a new century, it finds itself searching to create a more environmentally friendly manufacturing environment
New Products New Products
Laser Height Sensor The new CCD noncontact laser height sensor for the Millennium Series M-2000 system is said to provide high-speed dispense height measurement for delicate substrates, hybrids and ICs that may be compromised by tactile sensing
Editorial Kicking off 2001
Beginning a new year always conjures up all sorts of resolutions... organizing your desk (because it might be condemned by the local fire marshal)...eating the "right" foods (we'll bypass the whole dieting thing altogether)...maybe even setting aside more savings (so we can retire sooner?)
|