Issue

Five years ago the promise of wafer-level processing for advanced packaging meant improved performance, reduced form factor, and the potential of reduced packaging costs.

I recently put together a panel of experts to discuss the concept of "jisso," and what the Jisso North American Council hopes to accomplish.

At Amkor, we are addressing opportunities to expand the outsourced semiconductor assembly and test (OSAT) industry.

Scientists at the Fermi National Accelerator Laboratory (Fermilab) are working on a new major high-energy physics project, the BTeV (B physics at the Tevatron) experiment.

Total factory automation in test, assembly, and packaging (TAP) facilities has changed very little over the last decade.

Best-In-Class Product Density at Minimum Cost and Maximum Production Rates

An Emerging Model

Overcoming Mixed-Technology Design Challenges

Flexibility is key when it comes to die attach capabilities critical for hybrid microelectronics, especially in North America's automotive, medical and military markets.

"Embossing" is an ancient technical term in the English language, traceable to the period 1350 to 1400, and used by Chaucer in its present sense.