Issue



Table of Contents

Solid State Technology

Year 2005
Issue 12

DEPARTMENTS

Editorial Board


Advances in 3-D Electronics

The earliest electrical circuits appeared to be 3-D; discrete wires interconnecting circuit elements in 3 dimensions.


Notable Developments


Solder Bumping Single Die

Although computers and simulation software have accelerated product development, most electronic products eventually reach the traditional developmental stages of prototypes and samples.


New Products


NEW PRODUCTS


Industry Voices


Wafer-level Processes are Going Backwards-compatible

Whichever way you read the data or interpret the signs, modern product lifecycles are diminishing quickly enough to stretch the limits of feasibility.


News


In the News


Editorial


Looking Forward

In the month of December, as one year nears its close, I begin to think about where the world of advanced packaging has been and will go.


FEATURES

Marking Electronics Prod


Marking Electronics Products and Packages

Choosing the Right Method


Solder Bumping For Emerg


Solder Bumping for Emerging Wafer-level Packages

Expanding Technologies Match Demand


Investigating Electronic


Investigating Electronics Cooling Technologies

An alternative to pure thermals


Probe Cards Enable Wafer


Probe Cards Enable Wafer-level Test

Reducing Cost of Test


High Definition X Ray In


High-definition X-ray Inspection

Understanding the uses and limitations


Cover Story


The Inspection Connection 2

Latest Technologies in Optical Inspection