A Bumpy Trip for Solder Bumping
A recent study projects a major shift in the relative market shares of the most common solder bumping methods.
In the News
Automating IC Package Design
With advances in semiconductor fabrication driving into the nanometer range comes more pressure on IC packaging technologies to meet the needs of new devices.
Nanomaterials Promise Innovative Solutions
In today’s rapidly changing packaging environment, board assemblers find themselves caught between two converging trend lines.
Lead-free Impact on Wafer Bumping & Wafer-level Packaging
With the July 2006 date for implementation of the EU’s RoHS and WEEE Directives looming, most, if not all producers of electronic products are studying prospective technologies and looking for potential solutions for assembling products using lead-free solders.
There are times when we get so caught up in the news, natural emergencies, and keeping up with the latest technological whiz-bangs that we lose perspective.