Materials Compatibility Enables Next-Gen Performance in Packaging
Moore’s Law has taken us from microelectronics to nanoelectronics. The need to stay on the materials treadmill has never been greater.
New Aging Mechanism in Multilayer Ceramic Capacitators
s IC progress drives more functionality onto each IC die, fewer ICs on each PCB are required.
All I Want Is An Off-the-shelf High-frequency Package
More packages are being designed for high-speed, high-frequency chips, especially with the recent licensing of spectrums above 50 GHz.
Designers Turn to 3-D As Packages Mimic Manhattan Skyline
oday’s designers continually strive to pack more functionality into smaller component footprints, and provide more end-customer value by reducing the effort and the risk inherent in designing new devices and technology.
Growth Markets for Advanced Packages
Summertime offers lots of opportunities to look at new markets, refocus on those in the past, and regroup in general.
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