Issue



Table of Contents

Solid State Technology

Year 2005
Issue 1

DEPARTMENTS

Packaging Trends


Subcontractor Update: Caution Justified

The major assembly and test subcontractors were cautious in their projections for the third quarter of 2004, and the caution turned out to be justified, with revenue figures ranging from small growth to significant drops.


News


In the News


Industry Voices


Keeping Up With the Joneses: The Evolution of Leadframes

We all know array packaging??s benefits: higher I/O density, better design flexibility, a smaller footprint, and good thermal and electrical performance.


Editorial


Looking Into the Crystal Ball

This January issue contains the first industry forecast article that Advanced Packaging has written.


Editorial Board


R&D: Critical to Future Technologies

Research and development is critical to future technologies of every sort. In the realm of electronics, R&D is both the heart and life??s blood of the industry.


FEATURES

3 D Design Of Stacked Di


3-D Design of Stacked Die and SiP

MEETING REQUIREMENTS OF COMPLEX PACKAGING TECHNOLOGIES


The Back End Process


Design Considerations

Wafer-level CSP RDL


2005 Ap Industry Forecas


2005 AP Industry Forecast

As we begin 2005, back-end packaging is coming away from a profitable year. Most industry forecasters expect a moderate, cyclic decline in the upcoming year, followed by a slight recovery in 2006, and healthy expansion in 2007.