Table of Contents

Solid State Technology

Year 2007
Issue 7


Advanced Packaging Road

Coming Soon in 3D

Editorial Board

3D: Is the Best Yet to Come?

New Products


Pvd Processing For Flip

PVD Processing for Flip Chip

Advanced packaging processes use physical vapor deposition (PVD) for gold bumping, solder bumping, redistribution (RDL), and integrated passive components.

Notable Developments

The Occam Process: A Package-first Approach to Electronics Assembly

Tin-lead solder was pressed into service as means of making reliable permanent interconnections between electronic elements in the early years of the electronics industry.

Industry Voices

Correct-by-construction Methodology Enables Consumer Electronics Designs

The Japanese market, with its focus on consumer electronics and telecommunications, has embraced chip/package co-design and optimization for wire-bonded and system-in-package (SiP) devices.




What, Me Worry?


The Back End Process

Molding Transforms to Meet Advanced Market Requirements

Integral to the packaging process for over three decades, epoxy molding compounds have undergone significant advancements due to revolutions in semiconductor package geometries, and legislative requirements surrounding lead-free and “green” material adoption.

Integrating Thermal Mana

Integrating Thermal Management and Burn-in Operations

In the semiconductor industry challenges appear to be directly related to Moore’s Law. In reality the culprit is consumer demand for more functionality, faster speeds, and smaller features. Technically, the integrated circuit (IC) industry is progressing at a rate that’s unmatched by any other industry. Yet, moving forward, it faces technical hurdles that slow progress, and must create advanced solutions without increasing costs.

Automatic Optical Inspec

Automatic Optical Inspection of IC Connections

Die and wire bonding are among the most important IC connection technologies in electronic production.

Cover Story

High-brightness Matrix LEDs

Light-emitting diode (LED)-based applications are growing, and cover a broad range of markets including automotive lighting applications such as indicators, spot utility, and headlamps; camera functions like display backlights and camera flashes; consumer products such as LCD display backlight and projection systems; architectural uses like accent lighting for buildings, and signs; and many others. LEDs are bright, efficient, and quick to react.