Table of Contents

Solid State Technology

Year 2007
Issue 5


Advanced Packaging Award

Your Vote Matters

Advanced packaging is a dynamic sector of the semiconductor device manufacturing realm, as evidenced in the breadth of back-end and final assembly-and-test products on display at this year’s SEMICON West exhibition, held July 16-19 at the Moscone Center in San Francisco, CA.

Editorial Board

Catching Up with Moore’s Law: Are Industry Consortia the Key?

Greetings from the Constitution State. For my first contribution to this publication - since developments in new packaging technology have failed to keep pace with Moore’s Law - I chose to consider industry consortia’s role in accelerating the rate of advancement in device packaging.

Advanced Packaging Award

2007 Finalist Showcase



Industry Voices

Why Standard Materials Metrics Aren’t Enough

For decades, materials developers and formulators have used common, industry-standard measurement tools for assessing a given material’s properties and characteristics to provide some indication of performance.

Notable Developments

Thermal Management Goes Nano with CNT Fabrics

Concepts from the textile industry may soon infiltrate thermal management in advanced packaging, in the form of manufactured spun threads and felted mats composed of single-wall carbon nanotubes (CNTs).


MEMS Market Shows Growth

Micro-electromechanical systems (MEMS) comprise a broad category of packages - sensors, gyroscopes, accelerometers, and more - that attract attention everywhere.

Advanced Packaging Road

Something’s Brewing

Rohm and Haas Electronic Materials, Marlborough, MA


The Back End Process

Optimizing the Wire Bond Process

Demands for continuously smaller IC packages with increased I/O capability are requiring tighter wire-bond loop tolerances.

Hybrid No Flow Underfill

Hybrid No-flow Underfill for Flip Chip

Underfills are used in flip chip packaging to help mitigate the effects of the large coefficient of thermal expansion (CTE) mismatch between the silicon chip and the laminate circuit board.

The Evolution Revolution

The Evolution Revolution in Flux

Fluxes - the brownish, fairly liquid material that allows molten solders to wet onto other metal surfaces - have come a long way from their rather primitive SMT forbears in solder paste, wave soldering, and rework to fulfill diverse needs in the semiconductor market.

Laser Applications In Ad

Laser Applications in Advanced IC Packaging

Much ado has been made over the need to wring increased performance out of the same silicon real estate and/or device structures.

Cover Story

Dicing MEMS

Micro-electromechanical systems (MEMS) include a variety of miniaturized intelligent mechanical systems such as accelerometers, flow sensors, motion mirrors, and radio-frequency (RF) devices.