LED Manufacturing

LED MANUFACTURING ARTICLES



Cree licenses remote phosphor patents to LED lighting makers

12/22/2011 

Cree Inc. (Nasdaq:CREE) granted 5 LED lighting manufacturers licenses to select Cree patents through its remote phosphor licensing program. Cree's licensing program facilitates the development of LED lights combining remote phosphor optical elements with blue LEDs.

Present at Strategies in Light Europe 2012

12/19/2011 

Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.

LED inspection unit launches Altatech Semiconductor's LEDs line

12/14/2011 

Altatech Semiconductor S.A. launched its first LED inspection system, the non-contact AltaSight LEDMax, for detecting, classifying and characterizing defects on wafers used in manufacturing LEDs.

SEMICON West 2012: Submit an abstract today

12/12/2011 

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.

First LEDs fabricated on amorphous glass substrates

12/07/2011 

Researchers at the Samsung Advanced Institute of Technology and Seoul National University have demonstrated the first LEDs to be fabricated on amorphous glass substrates.

LED PSS etch station speeds throughput with higher temps

11/30/2011 

MicroTech has developed a wet process station to etch patterned sapphire substrate (PSS) wafers in a way that increases LEDs' light output and efficiency while increasing manufacturing throughput.

Applied Materials' 2011 supplier awards

11/15/2011 

Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.

Philips Lumileds deploys MES from Camstar globally

11/10/2011 

Philips Lumileds, solid state lighting (LED) maker, deployed Camstar Systems Inc.'s Manufacturing Execution System (MES) at all global sites in less than 12 months.

LEDs and a MOCVD bubble: We've only just begun

11/09/2011 

Scanning the latest reports from a quartet of Wall Street analysts, a number of key themes emerge explaining what's driving a MOCVD slump in 2011-2012 (and maybe beyond), and how and when the situation might improve.

China lights up LED roadmap; Taiwan leaders seek similar support

11/07/2011 

China lays out its five-year plan to phase out old bulbs and spur LED demand; and Taiwan leaders invoke painful memories of DRAM and LCD market squeezes to urge more support for their own LED industry.

LEDs get efficiency boost from ZnO microwires

10/31/2011 

Georgia Tech researchers have found that GaN LEDs get a significant efficiency boost from zinc oxide microwires. The piezo-phototronic effect charges LEDs' ability to convert electricity to UV light, which GA Tech believes is a first for the LED industry.

Strategies in Light adds LED manufacturing track

10/25/2011 

Strategies in Light, an annual tradeshow on high-brightness LEDs and lighting hosted by Strategies Unlimited and PennWell Corporation, will take place February 7-9, 2012 in Santa Clara, CA. New this year, the conference will include a full parallel track on LED manufacturing.

Bridgelux fundraises for GaN-on-Si LED ramp

10/25/2011 

Bridgelux closed an additional $15 million in financing to accelerate R&D and scaling of Bridgelux's gallium nitride on silicon (GaN-on-Si) LED chip technologies.

RBCN brings aluminum oxide processing in-house

10/21/2011 

Rubicon Technology Inc. (NASDAQ:RBCN) will transition to on-premise aluminum oxide processing to better control the quality of its sapphire wafers, and reduce manufacturing expenses while ensuring a steady supply of raw materials for large-diameter wafers.

Optogan LED chip fab opens in Germany

10/14/2011 

Optogan opened its LED production site in Landshut, Germany, planning to produce 1 billion chips/year initially.

Quantum-dot LED display made via transfer printing

10/13/2011 

Researchers from the Samsung Advanced Institute of Technology (SAIT) and the University of Cambridge created a full-color high-resolution 4" quantum dot light emitting diode (QD-LED) display using transfer printing.

Flat silicon wafer shipments will pick up in 2012, 2013

10/12/2011 

While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.

HB-LED revenues contend with supply growth, demand slowing

10/07/2011 

Revenues for HB-LEDs grew 108% to $11.2 billion in 2010, driven by applications in TV backlight units, according to Strategies Unlimited. The party is quieting down though, as expanding supply and a slowdown in overall TV demand in 2011 pushed LED prices drastically lower and squeezing out weaker makers.

DOE funds LED manufacturing R&D with up to $10M

09/27/2011 

The US DOE is accepting funding applications through December 15, 2011, for developers of solid-state lighting such as LEDs and OLEDs. Up to $10 million is available to research lower-cost manufacturing methods.

Pixelligent raises over $5M on high demand

09/27/2011 

Pixelligent LLC, nanocrystal additive maker, closed $5.1 million in funding. The round was 6 times over-subscribed, requiring the company board to significantly upsize the round.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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