LED Manufacturing

LED MANUFACTURING ARTICLES



LED makers shifting focus from efficacy to manufacturing efficiency for mass-market leap

06/29/2011 

SEMICON West preview: With device efficacy approaching limits and end-costs still too high for mass-market adoption, LED manufacturers are looking to trim costs by improving key manufacturing steps: measuring process conditions, preparing and handling substrates, and wafer-level testing.

LED adoption pushes driver IC changes and growth

06/28/2011 

As LED adoption continues to grow, LED driver ICs face pressure from increased IC integration, driver-less AC-LEDs and other technologies, and falling prices. However, the driver IC unit can bring performance and power enhancements that consumers want for LED lighting adoption.

MRS Spring 2011: Lighting the paths for LED materials

04/26/2011 

Michael A. Fury looks at papers from the opening day of this year's MRS Spring meeting, including various takes on light-emitting devices, nanotubes for optoelectronic devices, and switching behavior of ultrathin films.

LED-maker-taps-Oxford-Instruments-for-etch-deposition

03/21/2011 

The Optogan Group placed a multi-system order for Oxford Instruments' etch and deposition systems. These include PlasmaPro System133 ICP and PlasmaPro 800Plus RIE etch systems, and a PlasmaPro 800Plus deposition system. 

Veeco GaN MOCVD tool debut

02/17/2011 

Veeco's TurboDisc MaxBright MOCVD, LED TV penetration Veeco Instruments' new TurboDisc MaxBright GaN MOCVD multi-reactor system is poised to take advantage of what the company believes is an accelerated rate of LED TV penetration. The new system targets manufacturing of HB-LEDs and is capable of single- or multi-chamber layer growth.

Palomar discusses high volume HB LED assembly at Strategies in Light

02/11/2011 

Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.

HBLED Manufacturing: Gearing Up

02/01/2011  Peter Singer, Editor-in-Chief

Semi LED fab capacity: Cause for concern, says Dieseldorff, SEMI

01/28/2011 

Semiconductor/LED fab capacity analysis 2011Speaking at SEMI’s Industry Strategy Symposium, Christian Dieseldorff, SEMI senior analyst, provided an in-depth look at fab construction, capacity, and capex in 2011 and 2012. In this podcast, Dieseldorff walks listeners through fab construction projects by region and device type (LED, non-memory, memory, etc.)

Semiconductor fab to make InGan solar cells for BluGlass

01/07/2011 

BluGlass (ASX:BLG) has commissioned the foundry services of  Rainbow Optoelectronics Materials Shanghai to provide device fabrication and processing services for the purposes of creating a nitride solar cell prototype designed by BluGlass.

EUV players hit 100W output with LPP source

04/27/2010 

The Extreme Ultraviolet Lithography System Development Association (EUVA) says it has surpassed 100W output at intermediate focus for an EUV light source, another big step to address a big hurdle facing EUV lithography as a production-viable candidate for next-generation semiconductor manufacturing.

Oxford Instruments buys TDI, expands HB-LED biz

04/11/2008  Apr. 11, 2008 - UK-based Oxford Instruments says it has acquired Silver Spring, MD-based Technologies and Devices International, a developer of hydride vapor phase epitaxy (HVPE) technology and processes, in a bid to expand its offerings for makers of high-brightness LEDs.

Report: Intel's Dalian fab attracting LED work

03/25/2008  Mar. 25, 2008 - Intel's decision to locate a 300mm fab in Dalian, China, has spurred interest in the area for other industries, including LED makers from Taiwan, with Epistar and Everlight Electronics considering building a joint facility there, according to the Taiwan Economic News.

Two Trade Shows to Run at Same Time in October 08 Stuttgart

11/29/2007  ; MiNaT, a trade fair for precision mechanics and ultra-precision micro- and nanotechnologies, has shifted its dates so that it will take place at the same time as SEMICON Europa from October 7-9, 2008, in Stuttgart, Germany, to be able to share synergies and boost attendance and exhibitors at both shows.

Automotive LED Manufacturer Selects Henkel Materials

09/07/2007  Grote Industries selected a custom-formulated Hysol potting compound from Henkel to enable full automation at its 1-million-parts per year LED lamp assembly line. The compound met 19 engineering requirements for environmental friendliness, thermal conductivity, reliability, and other criteria, and will be deployed for use across 10 product families.

LED Output Increases with 100-mm Dicing

04/12/2007  A 100-mm sapphire wafer-dicing capability, developed on J.P. Sercel Associates' IX-200 Chromadice DPSS UV laser wafer-singulation system, reportedly increases LED yields by processing larger sapphire wafers than prior methods.

MIT spinoff touts quantum-dot LED materials work

01/19/2007  January 19, 2007 - QD Vision, a startup founded by MIT scientists in 2004 says it has received a US patent for "Stabilized Semiconductor Nanocrystals," materials that the company says can enhance the performance of quantum dots, for use in quantum dot light-emitting devices (LED) for flat displays.

SIA: Cell phones, China boost 1Q chip growth

05/01/2006  May 1, 2006 - Strong sales of cell phones, particularly in China, drove higher semiconductor sales in 1Q06 to a 7.3% increase from a year ago, according to the Semiconductor Industry Association (SIA).

EOS technology targets brighter, long-lasting LEDs

01/25/2006  January 25, 2005 - Edmund Optics Inc., Barrington, NJ, has unveiled an illumination delivery technology to increasing illumination brightness in LEDs as well as their lifetimes.

Luxxon awards gas delivery system contract to Praxair Chemax

08/23/2004  August 23, 2004 - Praxair Chemax Semiconductor Materials Co. Ltd., a joint venture between Praxair Inc. and China Petrochemical Development Corp., has been awarded a contract by LED manufacturer, Luxxon Technology Corp.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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