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Global GaN semiconductor devices market is expected to be worth $3438.4M by 2024

08/31/2016  The global market for gallium nitride (GaN) semiconductor devices is largely consolidated, with the top four companies commanding a share of over 65% of the overall market in 2015, states Transparency Market Research (TMR) in a new report.

Samsung introduces high-performance LED linear modules for indoor lighting applications

08/26/2016  Samsung Electronics Co., Ltd. today announced “H-series Gen 3,” a new line-up of LED linear modules that features high efficacy and enables easy replacement of fluorescent lights with LED lamps.

Following the UV curing boom, disinfection and purification applications are finally ready to take off

08/25/2016  In a short term, UV curing will drive the UV LED market, announces Yole Développement (Yole) in its new LED report entitled UV LEDs: Technology, Manufacturing and Applications Trends.

New electrical energy storage material shows its power

08/25/2016  A powerful new material developed by Northwestern University chemist William Dichtel and his research team could one day speed up the charging process of electric cars and help increase their driving range.

IHS Markit releases ranking of Top LED suppliers

08/18/2016  IHS Markit released its annual 2015 revenue-share ranking of the top LED suppliers in backlighting, automotive, lighting and other applications.

Toshiba introduces high-voltage MOSFET family for efficient, high-speed switching

08/18/2016  Toshiba America Electronic Components, Inc. today announced a new lineup of ultra-efficient, high-speed, high-voltage MOSFETs for switching voltage regulator designs.

Advanced materials manufacturer Pixelligent closes $10.4M in funding

08/15/2016  Pixelligent Technologies, a developer of high-index advanced materials for solid state lighting and display applications and producer of PixClear products, announced today that it closed $10.4 million in new funding.

Epistar orders multiple Veeco EPIK 700 MOCVD systems to meet demand for LED lighting applications

08/12/2016  Veeco Instruments Inc. announced today that Epistar Corporation has ordered multiple TurboDisc EPIK 700 GaN MOCVD Systems for the production of LEDs.

Two become one: How to turn green light blue

08/10/2016  Metal-organic frameworks with a piggyback structure open up new possibilities for solar cells and LEDs -- publication in the Advanced Materials scientific journal.

ams launches the industry's smallest module to offer color, ambient light and proximity sensing

08/02/2016  ams AG has launched the smallest ever optical sensor module that delivers a combination of colour (RGB), ambient light and proximity sensing, providing OEMs with design flexibility and the ability to provide a better display viewing experience.

New method for making green LEDs enhances their efficiency and brightness

07/29/2016  Researchers at the University of Illinois at Urbana Champaign have developed a new method for making brighter and more efficient green light-emitting diodes.

Integration of novel materials with silicon chips makes new 'smart' devices possible

07/21/2016  Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.

GaN substrate market is estimated to be worth over $4B by 2020

07/19/2016  The gallium nitride (GaN) substrates market is set to cross $4 billion USD by 2020, according to the market research report from IndustryARC.

Molecular switch for controlling color and fluorescence

07/15/2016  A collaboration of researchers from Kumamoto, Yamaguchi, and Osaka Universities in Japan have discovered a new method of drastically changing the color and fluorescence of a particular compound using only oxygen (O2) and hydrogen (H2) gases.

Kateeva: Enabling OLED success

07/13/2016  Kateeva is out to change the way displays are being made, and during Tuesday’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.

SiC power business is a reality

06/27/2016  Today, SiC benefits are not a secret anymore and progressively lot of industries are considering the development of new products including SiC technologies.

Automotive semiconductor market grows slightly in 2015 while ranks shift

06/22/2016  Despite slower growth for the automotive industry and exchange rate fluctuations, the automotive semiconductor market grew at a modest 0.2 percent year over year, reaching $29 billion in 2015, according to IHS.

Samsung introduces new line-up of LED components for automotive lighting, featuring chip-scale packaging

06/21/2016  Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

Ultratech enables world's lowest contact resistivity for finFETs with LXA melt laser annealing technology

06/16/2016  This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.

WPG Americas Inc. announces distribution agreement with Seoul Semiconductor

06/15/2016  WPG Americas Inc. announced today it has signed a new agreement with Seoul Semiconductor the world's fifth largest LED supplier to distribute their full complete line of products.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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