LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Crystal IS introduces Optan LED technology

06/12/2014  Crystal IS, a developer of high-performance ultraviolet (UVC) LEDs, this week announced availability of Optan.

Dow Corning silicone wins Innovation Award at 2014 LIGHTFAIR International

06/05/2014  This marks the third time in two years that Dow Corning’s Moldable Silicone product technology has garnered top recognition during LIGHTFAIR International’s (LFI) annual awards.

Samsung improves color rendering in its LED components

06/02/2014  Samsung Electronics today announced that it has improved the light quality of its LED packages and modules based on a 90 CRI (Color Rendering Index) for use in advanced lighting applications.

Seoul Semiconductor launches high power Acrich package for outdoor lighting

05/28/2014  Seoul Semiconductor this week announced the release of a new generation of Acrich MJT 5050 LEDs, with high lumen output, reliability, and cost performance optimized for the outdoor lighting market.

Crystal IS primes for transition to commercial manufacturing

05/20/2014  Crystal IS, a developer of the most effective UVC LEDs, today announced the appointment of John Gartner as its first vice president of operations.

Cree announces low cost extended bandwidth GaN HEMT transistors

05/07/2014  In response to broader bandwidth demand, Cree, Inc. introduces a family of GaN HEMT RF transistors that delivers industry-leading bandwidth and high efficiency performance to support today’s busy LTE networks.

Veeco appoints Shubham Maheshwari as chief financial officer

05/06/2014  Mr. Maheshwari replaces David D. Glass, who announced his retirement from Veeco last December.

More GaN-on-Si players on the playground, business is starting

04/24/2014  GaN-on-Si is entering in production. Under this context, what is the patent situation?

Epistar extends collaboration with Intermolecular

04/24/2014  Intermolecular, Inc. today announced that Epistar Corp. and Intermolecular have signed a multi-year extension of their existing collaborative development program (CDP) and royalty-bearing IP licensing agreement to increase the efficiency and reduce the cost of Epistar's light emitting diode (LED) devices.

Dow Corning moves to defend Chinese patent for LED optical silicone encapsulants

04/17/2014  Dow Corning filed a complaint through its Chinese subsidiary and licensee with the Shanghai First Intermediate Court.

Leti to demonstrate wireless high data rate Li-Fi prototype

03/27/2014  CEA-Leti will demonstrate its new prototype for wireless high data rate Li-Fi (light fidelity) transmission at Light + Building 2014 in Frankfurt, Germany, March 30-April 4. The technology employs the high-frequency modulation capabilities of light-emitting diode (LED) engines used in commercial lighting.

Samsung introduces new flip chip LED packages

03/27/2014  Samsung today introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability.

New technique makes LEDs brighter, more resilient

03/21/2014  Researchers from North Carolina State University have developed a new processing technique that makes light emitting diodes (LEDs) brighter and more resilient by coating the semiconductor material gallium nitride (GaN) with a layer of phosphorus-derived acid.

GaN-on-Si enables GaN power electronics, will LED transition as well?

03/19/2014  Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost.

Double digit growth for China LED production in 2014

03/10/2014  Following the boom in expansion of the Chinese LED market in 2011, many industry insiders and analysts speculated on whether the Chinese would be able to sustain the growth, or if many companies simply ordered an excessive amount of MOCVD reactors just to benefit from government subsidies.

Cree introduces the industry's most powerful SiC Schottky diodes

03/05/2014  Cree today introduced the new CPW5 Z-Rec high-power silicon-carbide (SiC) Schottky diodes, the industry’s first commercially available family of 50 Amp SiC rectifiers.

EVG and Brisbane Materials introduce novel anti-reflective coating solution for LED lighting applications

02/25/2014  The jointly developed manufacturing solution enables lumen output increases of up to eight percent.

Soraa develops the world's most efficient LEDs

02/24/2014  Soraa announced today the world’s most efficient LED, which it will integrate into the market’s first full-visible-spectrum, large form factor lamps.

MCA appoints Brian Fisher as General Manager

02/19/2014  MCA Public Relations announced it has launched a new solid-state lighting (SSL) practice specifically designed to target companies from the multiple segments of the SSL ecosystem to create unique branding and communications campaigns for each.

NIKKISO establishes new production facility for deep ultraviolet LEDs

01/23/2014  The company will initiate production operations in mid 2014 and install an annual capacity in excess of 1 million units for its UVB and UVC LED illumination sources.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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