LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Cree introduces industry’s first $99 LED street light

08/06/2013 

Cree, Inc. today announced a technology breakthrough for the LED street lighting market.

LED oversupply likely to continue as suppliers add production capacity

08/02/2013 

Despite a major surplus in the light-emitting diode (LED) market, top suppliers are increasing their capital spending and production because of government incentives and in order to cash in on an expected boom in the lighting business.

Epi-wafer market to grow to $4 billion in 2020 as LED lighting zooms to $80 billion

07/18/2013 

GaN-on-Sapphire remain the entrenched incumbent; leading challenger GaN-on-silicon will gain only a 10 percent market share, Lux Research says.

Smart lighting market to grow 37% between 2013 and 2018

07/17/2013 

At present, Europe has the largest market for smart lighting especially in commercial industrial buildings, outdoor lighting, and automobiles applications.

Report forecasts that LED luminaire business will reach $516M market by 2016

06/12/2013 

Road and street lighting is a key driver for LED technology in general lighting.

CEA-Leti wins Avantex Innovation Prize for E-Thread technology

06/10/2013 

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.

LED ingot market to reach $325M by 2015

05/07/2013 

The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).

Samsung introduces new, high efficacy chip on board LED packages

04/22/2013 

Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.

Plessey is first to release GaN on silicon LEDs

04/08/2013 

Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.

University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

04/05/2013 

A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.

Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy

04/04/2013 

Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.

Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture

04/03/2013  p>Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its program with Aledia, its nanowire-LED partner.

Global LED lighting market will be worth $25.4 billion in 2013

03/27/2013 

The global LED lighting market will be worth $25.4 billion in 2013, representing 54% growth on the 2012 figure of $16.5, while the LED lighting penetration rate will also rise to 18.6%, according to a new DIGITIMES Research Special Report titled "Global high-brightness LED market forecast."

Aledia makes its first LEDS on 8-inch silicon wafers using microwire technology

03/27/2013 

Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.

Crystal IS announces record performance from a single chip UVC LED

03/21/2013 

Higher performance UVC LEDs help to realize ever more increasing range of customer applications including scientific instrumentation and water disinfection.

New packaging system broadens array performance while reducing the cost of LED lighting

03/21/2013 

Bridgelux, a developer and manufacturer of LED lighting technologies and solutions, today unveiled the Vero LED array, a new lighting platform that simplifies design integration and manufacturing and gives designers a more flexible LED lighting solution.

Modern power design challenges to be discussed at APEC 2013

03/20/2013 

ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.

Oxford Instruments’ newest tool streamlines batch production for HBLED

03/18/2013 

Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro 1000 Astrea etch system, a large batch etch solution for PSS, GaN and AlGaInP that will offer HBLED production manufacturers high throughput.

Cree announces volume production of second generation SiC MOSFET

03/13/2013 

Cree, Inc. announces the release of its second generation SiC MOSFET, enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver power density and switching efficiency at half the cost per amp of Cree’s previous generation MOSFETs.

The UV LED market is booming

03/11/2013 

Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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