LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Student develops brighter, smarter and more efficient LEDs

03/08/2013 

Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properties than those on the market today.

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

03/06/2013 

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.

Displaybank releases forecast and analysis of the OLED lighting market

03/05/2013 

Recently, as the importance of environmental protection grows, the method of saving energy of products and using eco-friendly materials is on the rise. Of these, since lighting accounts for about 20% of the overall power consumption, the efforts to replace with high-efficiency and eco-friendly products are being made actively.

ams introduces intelligent flash LED driver

03/05/2013 

LED driver matches flash LED input current with safe output capability of battery – in real time.

LED-based street lighting market forecasted to surpass $2 billion in 2020

02/28/2013 

Dramatically falling costs and improvements in efficiency are driving increased sales of light emitting diode (LED) lamps for street lighting. Costs have fallen as much as 50% over the past two years and are expected to continue falling. By 2015, LEDs will become the second-leading type of lamp for street lights in terms of sales, behind only high pressure sodium lamps, according to a new report from Pike Research, a part of Navigant’s Energy Practice. By 2020, the study concludes, LED lamps for street lights will generate more than $2 billion in annual revenue.

NEWLED aims to revolutionize the way the world is lit

02/26/2013 

The way the world is lit up could be revolutionized by a new European-wide research project being led by the University of Dundee.

FOREPI signs multiple order for AIXTRON production system

02/26/2013 

AIXTRON SE today announced that, in the third quarter of 2012, long-term customer Formosa Epitaxy Inc. (FOREPI), Taiwan, placed a new order for multiple CRIUS II-L MOCVD production systems in a 69x2-inch configuration. All systems will be used for the manufacturing of ultra-high brightness (UHB) GaN-based blue and white LEDs.

Lux Research names top firms in LEDS and power electronics

02/26/2013 

As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.

GT Advanced Technologies to produce low-cost GaN template substrates with Soitec

02/25/2013 

HVPE system expected to lower the cost of LED production and accelerate adoption in commercial and residential lighting.

Scientists develop multicolor LEDs without heavy metals

02/25/2013 

Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.

UPDATED: Worldwide LED component market grows 9% with lighting

02/20/2013 

Strategies Unlimited has issued new figures since the first edition of this article. Solid State Technology now brings you updated figures and additional information on the worldwide LED market.

Soraa announces next generation of GaN on GaN LEDs

02/14/2013 

Soraa announced yesterday the next generation of its high external quantum efficiency GaN on GaN LEDs.

InfiniLED MicroLEDs achieve ultra-high light intensity

02/13/2013 

InfiniLED’s latest MicroLEDs, or µLEDs, have produced record optical beam intensity

Mitsubishi develops SiC ingot slicing technology

02/08/2013 

Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.

LED technology and market challenges addressed in Taiwan

02/07/2013 

To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.

Patent analysis: Flexible roll-to-roll processing

02/05/2013 

A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.

New type of LED produced with simple, low cost process

01/28/2013 

Professor Yue Kuo at Texas A&M University has fabricated a new type of LED, based on light emission from an ultra-thin amorphous dielectric layer.     

KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

12/06/2012 

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.

ProTek offering unpackaged die for LEDs

10/23/2012 

ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.

Roll-to-roll plasma etch equipment project completed

10/17/2012 

FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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