10/15/2012 

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.

10/08/2012 

Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.

10/05/2012 

ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.

08/15/2012 

Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa

08/13/2012 

OSRAM AG, LED manufacturer, laid the foundation for its Wuxi, China, plant, in a ceremony attended by high-ranking representatives of the Jiangsu province.

08/08/2012 

The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.

07/31/2012 

NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.

07/31/2012 

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.

07/19/2012 

Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon LED component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.

07/17/2012 

Avnet Electronics Marketing Americas, part of Avnet Inc. (NYSE:AVT) opened a lighting lab in Chandler, AZ, to measure LED properties for various applications.

07/17/2012 

Intematix Corporation, phosphor and phosphor component developer for LEDs, plans to conduct a registered initial public offering (IPO) of its common stock.

07/16/2012 

Lily Li, patent strategist at IP Checkups, examines remote phosphors for LED bulbs, in "Patents compete for priority in the remote-phosphor LED technology space," LEDs Magazine, July/August issue.

07/16/2012 

The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.

07/02/2012 

SemiLEDs Corporation (NASDAQ:LEDS) combined its vertical LED chip architecture with a proprietary metal alloy substrate to create the Enhanced Vertical (EV) LED product line.

06/28/2012 

SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.

06/20/2012 

LTI Optics’ Photopia Parametric Optical Design Tools module enables creation of optical designs to achieve a prescribed distribution of light. LUXeXcel introduced its one-step 3D Printoptical printing process for plastic optics for lighting fixtures, which can create custom optics from the LTI Optics' CAD model at prices competitive with injection molding.

06/18/2012 

Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.

06/15/2012 

Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.

06/14/2012 

Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.

06/13/2012 

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.