LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES


Cree opens LED technical eval centers in China

06/13/2012 

Cree Inc. (Nasdaq:CREE) is opening new technology centers in Shenzhen and Shanghai, China, expanding Cree TEMPO (Thermal, Electrical, Mechanical, Photometric, Optical) Services for LED lighting manufacturers evaluating LED luminaires.
High Tech Lights "reshores" LED manufacturing and R&D jobs

06/12/2012 

High Tech Lights is participating in a “Reshoring Initiative” by bringing job positions from China to the US for LED and laser diode scientists, manufacturing and assembly workers, and R&D staff.
LED package sales to increase but revenues will stay flat until 2014

06/04/2012 

Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.
Osram plans LED packaging facility in Wuxi

06/01/2012 

OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.
Phosphor market expands as LEDs move into lighting applications

05/30/2012 

Phosphors used in LED lighting applications will see a market increase to over $1.6 billion by 2019, says NanoMarkets. Phosphors help control LED luminous efficacy and color to bring the technology on a level with traditional lighting.
JEDEC creates LED test standards series

05/23/2012 

JEDEC Solid State Technology Association created a series of standards, JESD51-5x, for component-level testing of high-brightness/power LEDs.
Indium expands electronics materials manufacturing with new facility in NY

05/23/2012 

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Dow acquires LED phosphor technology IP in Lightscape Materials buy

05/16/2012 

Lightscape Materials offers IP in specialty phosphor technology, which Dow will add to its LED technologies portfolio. Lightscape co-founders Gerard Frederickson and Yongchi Tian will join Dow’s LED Technologies team.
Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

05/16/2012 

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company
The low utilization/MOCVD uptick phenomenon, LED efficacy and price, more from Lightfair

05/14/2012 

Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.
GE integrates LED thermal management for 100W bulb within A-19 form factor

05/09/2012 

GE’s 27-watt Energy Smart LED bulb is in a standard “A-19” bulb shape, manufactured with a proprietary synthetic jet technology enabled by Nuventix’ collaboration.
LED efficiency boosted by quantum dot and formic acid combo

05/09/2012 

Vanderbilt University researchers have used formic acid to develop white-light quantum dots' fluorescent efficiency to 45%, enabling UV LED efficiency of 40 lumens/watt.
LED maker SunSun Lighting raises $30M from investors

05/09/2012 

SunSun Lighting, a provider of high-performance, energy-efficient and low-cost LED lighting technologies, received $30 million in Series B financing from GSR Ventures and Oak Investment Partners and additional commitments from its original angel investors. Allan Kwan, a China-based advisor for Oak, is joining the board of SunSun.
HB-LED makers drive economic improvement with alternative substrates, automation, and yield

05/08/2012 

SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.
Lower-cost LED backlights darken CCFL's future

05/07/2012 

Low-cost direct LED-backlit LCD TVs were introduced in March 2011, targeting share in the entry/mainstream LCD TV market currently dominated by CCFL-backlit TVs. They will eliminate CCFLs by 2014, says DisplaySearch.
SATS provider Carsem begins LED packaging and test

05/04/2012 

Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.
Intematix remote phosphor enables 100W-equivalent LED bulbs

05/03/2012 

Intematix debuted ChromaLit Contour remote phosphor architecture. ChromaLit Contour is shaped to enable internal and external convection airflow, cooling LEDs in 60, 75 and 100W-equivalent omni-directional lights.
Cree LED test suite TEMPO 24 incorporates IES LM-79

05/01/2012 

Cree Inc. added TEMPO 24 tests to its Cree Services for LED luminaires. TEMPO 24 combines the IES LM-79-08 photometric test with nearly a dozen other LED performance tests.
LED manufacturer Lumichip expands in Finland, opens development center

04/27/2012 

Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.
Ultratech brings former member back to Board

04/19/2012 

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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