LED Packaging and Testing

LED PACKAGING AND TESTING ARTICLES



Transphorm secures investment from Yaskawa Electric

11/29/2017  Transphorm Inc. announced it received a $15 million investment from Yaskawa Electric Corporation.

The stacked color sensor

11/16/2017  True colors meet minimization.

Seoul Semiconductor introduces an Acrich-based compact LED lriver with 5X the power density of conventional drivers

11/15/2017  Seoul Semiconductor has developed an ultra-compact LED driver series with a power density 5X higher than conventional LED drivers.

SunLike series LEDs from Seoul Semiconductor deliver natural spectrum human-centric lighting sources

11/13/2017  Seoul Semiconductor exhibited its new SunLike Series LEDs, the world's first LED to produce light that closely matches the spectrum of natural sunlight, at the recent Professional Lighting Design Conference.

Tech increases microfluidic research data output 100-fold

11/09/2017  Researchers have developed a technique that allows users to collect 100 times more spectrographic information per day from microfluidic devices, as compared to the previous industry standard. The novel technology has already led to a new discovery: the speed of mixing ingredients for quantum dots used in LEDs changes the color of light they emit - even when all other variables are identical.

Pixelligent Technologies appoints Alain Harrus and Gene Banucci to its Board of Directors

11/07/2017  Pixelligent Technologies announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

Veeco and ALLOS demonstrate 200mm GaN-on-Si performance to enable micro-LED adoption

11/01/2017  Veeco Instruments Inc. (Nasdaq: VECO) announced today the completion of a strategic initiative with ALLOS Semiconductors (ALLOS) to demonstrate 200mm GaN-on-Si wafers for Blue/Green micro-LED production.

Optoelectronics, sensors/actuators and discretes climb

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

Power GaN: Everything is in place for volume production

10/25/2017  Yole projects the explosion of the market with 84% CAGR between 2017 and 2022. The market value will so reach US$ 450 million at the end of the period.

Seoul Semiconductor's Horticultural Series LEDs deliver entire spectrum from UV-C to far-red

10/24/2017  The newly-introduced Horticultural Series LEDs from Seoul Semiconductor represent the only LED manufacturer to provide the entire spectrum of solid state lighting sources for the efficient growth and propagation of plants.

Researchers bring optical communication onto silicon chips

10/23/2017  Ultrathin films of a semiconductor that emits and detects light can be stacked on top of silicon wafers.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

SEMICON Europa 2017: Keynotes announced

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

SSL technologies enable the development of new functionalities in automotive lighting

10/09/2017  The automotive lighting market totaled US$25.7 billion in 2016 and is expected to reach US$35.9 billion in 2022, with a 5.7% CAGR between 2016 and 2022.

WIN Semiconductors enhances 0.25µm GaN power process

10/09/2017  The NP25 technology provides 28-volt operation with superior power density and efficiency for demanding power applications through Ku-band.

Solar-Tectic LLC receives patent for III-V thin-film tandem high-performance solar cell and LED technology

09/28/2017  The patent, the first ever for a thin III-V layer on crystalline silicon thin-film, covers group III-V elements such as Gallium Arsenide (GaAs), and Indium Gallium Phosphide (InGaP), for the top layer, as well as all inorganic materials, including, silicon, germanium, etc., for the bottom layer.

With more than $4B revenue, the LED lighting module market is showing attractive perspectives

09/28/2017  The LED lighting module industry is showing the emergence of innovative functions and the introduction of new market segments including automotive, smart lighting and horticultural markets.

Cree names Gregg Lowe as CEO

09/25/2017  Mr. Lowe succeeds Chuck Swoboda, per the transition plan announced in May.

Laser marking meets diverse challenges in fab and packaging

09/22/2017  The basics of laser marking are reviewed, as well as current and emerging laser technologies.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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