03/31/2017  Cree, Inc. announces the new XLamp XP-G3 Royal Blue LED, the industry’s highest performing Royal Blue LED.

03/28/2017  ams today announced the AS7225 tunable-white lighting smart system sensor, further broadening the solution set for sensor-integrated tunable-white lighting solutions.

03/24/2017  Ultratech, Inc. this week announced that two China foundries placed follow-on orders for laser spike anneal systems.

03/22/2017  Many large companies and startups are currently working on microLED technologies for display applications: from LED makers such as Epistar, Nichia or Osram to display makers like AUO, BOE or CSOT and OEMs such as Apple or Facebook/Oculus.

03/20/2017  SEMI today announced that it has moved its headquarters office to Milpitas, Calif.

03/16/2017  Jülich researchers have succeeded in controlling the growth of organic molecules using a special trick.

03/14/2017  The ConFab announces keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

03/09/2017  Russian physicists, with their colleagues from Europe through changing the light parameters, learned to generate quasiparticles - excitons, which were fully controllable and also helped to record information at room temperature.

03/08/2017  The company has leased an adjacent building at its Newark campus, adding 75,000 sq. ft. that is zoned for manufacturing and business operations.

03/03/2017  A Cornell-led group has demonstrated the ability to produce deep-ultraviolet emission using an LED light source, potentially solving several problems related to quantum efficiency of current devices.

03/02/2017  Seoul Semiconductor Europe, a subsidiary of Seoul Semiconductor Co. Ltd. today announced the availability of reference modules based on its package-free Wicop LEDs.

03/02/2017  Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth.

03/01/2017  Dow Corning further expanded the design flexibilities for LED packaging manufacturers today with the addition of five new optical encapsulants (OEs) to its portfolio of advanced LED solutions.

03/01/2017  Versum Materials, Inc. announced today that it would expand its manufacturing capacity at its Delivery Systems and Service (DS&S) headquarters in Allentown, Pennsylvania.

02/23/2017  LG Innotek today announced that the company has developed the world's first 70mw UV-C LED for sterilization applications.

02/19/2017  At SEMI's Industry Strategy Syposium this year, a merger's and acquisitions panel, moderated by Robert Maire of Semiconductor Advisors, took a look at how the industry might look in the future.

02/16/2017  Ultratech, Inc. today announced that it has received a repeat, multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems.

02/15/2017  Seoul Semiconductor announced the immediate start of the mass production of its LED chip-on-board package for use in LED filament bulbs, a market currently estimated to be $1.3 billion globally.

02/15/2017  Engineering researchers at Michigan State University have developed the first stretchable integrated circuit that is made entirely using an inkjet printer, raising the possibility of inexpensive mass production of smart fabric.