07/08/2014  Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

07/08/2014  The long night in solar energy may be coming to an end.

07/08/2014  With mobile devices continuing to shrink in size and wearable electronics emerging as a new market for semiconductors, advanced packaging technologies are taking on increasing importance in the global supply chain. Aside from the 3DIC package/system-in-package area, what is going on in semiconductor packaging these days?

07/07/2014  FinScale Incorporated, the semiconductor device and process innovation company, today announced immediate availability of its qFinFETTM technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers

07/07/2014  SEMI today announced that Martin Anstice, president and CEO, Lam Research Corporation; Kevin Crofton, president and COO, SPTS Technologies; Tien Wu, COO, ASE Group; and Guoming Zhang, executive vice president, Sevenstar Electronics, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

07/07/2014  SEMI projects back-to-back years of double-digit growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released here today at the annual SEMICON West exposition.

07/07/2014  Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

07/03/2014  Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

06/25/2014  The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

06/19/2014  Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

06/16/2014  In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

06/12/2014  Crystal IS, a developer of high-performance ultraviolet (UVC) LEDs, this week announced availability of Optan.

06/12/2014  The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

06/09/2014  According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

06/05/2014  This marks the third time in two years that Dow Corning’s Moldable Silicone product technology has garnered top recognition during LIGHTFAIR International’s (LFI) annual awards.

06/04/2014  After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

06/03/2014  Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

06/02/2014  Samsung Electronics today announced that it has improved the light quality of its LED packages and modules based on a 90 CRI (Color Rendering Index) for use in advanced lighting applications.

05/29/2014  SORAA, a provider of GaN on GaN LED technology, announced today that the company will launch and display large lamp versions of its innovative SNAP System along with new accessories at LIGHTFAIR International.

05/28/2014  The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.