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LEDS ARTICLES



Brewer Science unveils Apogee temporary wafer bonder

05/19/2014  Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.

Domestic outsourcing: A key component in successful reshoring

05/16/2014  After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

Improving financial predictability – is it chasing a mirage?

05/15/2014  There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

New policy helps combat counterfeit semiconductors

05/14/2014  A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Report projects OLED lighting market to hit revenues of $1.4B in 2019

05/14/2014  Industry analyst firm NanoMarkets has published its latest forecasts of the OLED lighting market predicting a $1.4 billion market opportunity in 2019.

First quarter semiconductor trends and update

05/08/2014  Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

Cree announces low cost extended bandwidth GaN HEMT transistors

05/07/2014  In response to broader bandwidth demand, Cree, Inc. introduces a family of GaN HEMT RF transistors that delivers industry-leading bandwidth and high efficiency performance to support today’s busy LTE networks.

Veeco appoints Shubham Maheshwari as chief financial officer

05/06/2014  Mr. Maheshwari replaces David D. Glass, who announced his retirement from Veeco last December.

Quantum Global Technologies joins SEMATECH to advance process tool chamber parts cleanliness

04/30/2014  Quantum Global Technologies LLC today announced it joined SEMATECH in Albany NY, to advance process tool chamber parts cleanliness and analytical methods to meet sub-20nm wafer fabrication process requirements.

SEMICON Southeast Asia to be launched in 2015

04/25/2014  Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI today announced the expanded scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia.

More GaN-on-Si players on the playground, business is starting

04/24/2014  GaN-on-Si is entering in production. Under this context, what is the patent situation?

Epistar extends collaboration with Intermolecular

04/24/2014  Intermolecular, Inc. today announced that Epistar Corp. and Intermolecular have signed a multi-year extension of their existing collaborative development program (CDP) and royalty-bearing IP licensing agreement to increase the efficiency and reduce the cost of Epistar's light emitting diode (LED) devices.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

04/22/2014  The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

Dow Corning moves to defend Chinese patent for LED optical silicone encapsulants

04/17/2014  Dow Corning filed a complaint through its Chinese subsidiary and licensee with the Shanghai First Intermediate Court.

Catching the (invisible) wave

04/11/2014  UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

Scalable CVD process for making 2-D molybdenum diselenide

04/10/2014  Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes.

SEMI announces Innovation Village at SEMICON Europa 2014

04/09/2014  After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

To bridge LEDs' green gap, scientists think small

04/04/2014  Nanostructures half the breadth of a DNA strand could improve the efficiency of light emitting diodes (LEDs), especially in the "green gap," a portion of the spectrum where LED efficiency plunges, simulations at the U.S. Department of Energy's National Energy Research Scientific Computing Center (NERSC) have shown.

2013: A year in review

04/04/2014  2013 was a record year in terms of semiconductor device revenues; the industry finally exceeded the long elusive $300 billion mark, registering almost 5 percent growth according to the SIA.

The sustainable manufacturing imperative

04/03/2014  While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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