LEDs

LEDS ARTICLES



Leti to demonstrate wireless high data rate Li-Fi prototype

03/27/2014  CEA-Leti will demonstrate its new prototype for wireless high data rate Li-Fi (light fidelity) transmission at Light + Building 2014 in Frankfurt, Germany, March 30-April 4. The technology employs the high-frequency modulation capabilities of light-emitting diode (LED) engines used in commercial lighting.

Samsung introduces new flip chip LED packages

03/27/2014  Samsung today introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability.

New technique makes LEDs brighter, more resilient

03/21/2014  Researchers from North Carolina State University have developed a new processing technique that makes light emitting diodes (LEDs) brighter and more resilient by coating the semiconductor material gallium nitride (GaN) with a layer of phosphorus-derived acid.

Enabling mobility for IoT with advanced semiconductor technology - at SEMICON Singapore 2014

03/20/2014  SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).

GaN-on-Si enables GaN power electronics, will LED transition as well?

03/19/2014  Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost.

EV Group establishes China headquarters in Shanghai

03/18/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

Silicon Innovation Forum to expand in 2014

03/13/2014  Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

03/12/2014  On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

Scientists build thinnest-possible LEDs to be stronger, more energy efficient

03/10/2014  As devices get smaller and faster, there is more demand for such semiconductors that are tinier, stronger and more energy efficient.

Double digit growth for China LED production in 2014

03/10/2014  Following the boom in expansion of the Chinese LED market in 2011, many industry insiders and analysts speculated on whether the Chinese would be able to sustain the growth, or if many companies simply ordered an excessive amount of MOCVD reactors just to benefit from government subsidies.

Weaker yen impact on the 2013 material and equipment market size

03/06/2014  Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Fab equipment spending to increase 20-30% in 2014

03/06/2014  The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Cree introduces the industry's most powerful SiC Schottky diodes

03/05/2014  Cree today introduced the new CPW5 Z-Rec high-power silicon-carbide (SiC) Schottky diodes, the industry’s first commercially available family of 50 Amp SiC rectifiers.

EVG and Brisbane Materials introduce novel anti-reflective coating solution for LED lighting applications

02/25/2014  The jointly developed manufacturing solution enables lumen output increases of up to eight percent.

Soraa develops the world's most efficient LEDs

02/24/2014  Soraa announced today the world’s most efficient LED, which it will integrate into the market’s first full-visible-spectrum, large form factor lamps.

MCA appoints Brian Fisher as General Manager

02/19/2014  MCA Public Relations announced it has launched a new solid-state lighting (SSL) practice specifically designed to target companies from the multiple segments of the SSL ecosystem to create unique branding and communications campaigns for each.

Advanced Energy highlights enabling pulsing tech for 2X/1Xnm at SEMICON Korea 2014

02/13/2014  Advanced Energy Industries, Inc. today will highlight its advanced pulsing technology at SEMICON Korea 2014.

SPTS Technologies opens new office in Korea

02/13/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

CPI presents ultra-flexible OTFT device array suitable for foldable AMOLED displays of the future

01/23/2014  The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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