LEDs

LEDS ARTICLES



NIKKISO establishes new production facility for deep ultraviolet LEDs

01/23/2014  The company will initiate production operations in mid 2014 and install an annual capacity in excess of 1 million units for its UVB and UVC LED illumination sources.

Soraa launches high color rendering, line voltage GU10 230V LEDs

01/22/2014  Soraa, a provider of in GaN on GaN LED technology, launched today the first line of high color and white rendering, high light output LED GU10 230V dimmable lamps.

Global LED chip market and forecast 2014

01/10/2014  Research and Markets has announced the addition of the "Global LED Chip Market & Forecasts Report, 2016" report to their offering.

Slideshow: CES 2014 Highlights

01/10/2014  This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

Universal Lighting Technologies announces corporate headquarters office relocation

01/10/2014  Universal Lighting Technologies, Inc. is starting the year on a high note with the announcement of its new corporate headquarters at 51 Century Blvd., Suite 230 in Nashville, Tennessee.

TOWA launches new Packaging Development Center

01/09/2014  The TOWA Corporation of Japan, a supplier of packaging equipment for semiconductor, electronics and LED industries, has decided to expand their activities in Europe with an Innovation Center for Packaging Development and announced the launch of TOWA Europe B.V.

Xicato expands and brings manufacturing to San Jose, California

01/09/2014  Company more than doubles its space to accommodate new LED light module manufacturing line in Silicon Valley.

Market for AMOLED materials set to surge in 2014

12/23/2013  With a flood of new competitors set to initiate or increase the production of active-matrix organic light-emitting diode (AMOLED) panels next year, demand for materials used to make AMOLEDs is forecast to rise by nearly 27 percent in 2014.

Soitec and CEA sign a five-year R&D partnership

12/18/2013  This new contract aims to support Soitec's strategy for the electronics, solar energy and lighting markets.

GaN-on-silicon LEDs forecast to increase market share to 40% by 2020

12/12/2013  The penetration of gallium nitride-on-silicon (GaN-on-Si) wafers into the light-emitting diode (LED) market is forecast to increase at a compound annual growth rate (CAGR) of 69 percent from 2013 to 2020, by which time they will account for 40 percent of all GaN LEDs manufactured.

Soitec and IntelliEPI to collaborate on GaAs semiconductor materials

12/12/2013  The agreement includes a technology license granted by Soitec to IntelliEPI, which may be extended to address future business opportunities in the GaAs market, including equipment transfer.

Slideshow: IEDM 2013 Highlights

12/11/2013  This week, industry leaders and experts have gathered in Washington D.C. at the 59th annual IEEE International Electron Device Meeting (IEDM) conference.

SEMICON West “Call for Papers” for New Semiconductor Technology Symposium, Science Park and TechXPOTs

12/10/2013  SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.

Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system

12/10/2013  SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

Nikkiso initiates shipments of deep ultraviolet LEDs

12/05/2013  NIKKISO CO. has announced that it has initiated shipments of commercial LED product samples emitting at a range of wavelengths in the UVB and UVC spectral regimes for industrial, biomedical, and environmental applications.

Lynk Labs grows patent portfolio for AC-LED technology

12/04/2013  Lynk Labs Inc., a AC LED technology company from circuits to systems has been granted another key patent by the US Patent Office. The patent covers vertical market segments of AC LED technology from the core AC LED circuits and powering methods to the lighting system level.

Lab school brings manufacturing technologies to middle-school classrooms

12/03/2013  A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

EV Group introduces full-field UV nanoimprint lithography system

12/03/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 720 automated UV nanoimprint lithography (UV-NIL) system.

Rubicon Technology appoints Warren Stewart as Senior VP of Sales and Marketing

11/21/2013  Rubicon Technology, Inc. today announced that Warren S. Stewart III has joined the Company as Senior Vice President of Sales and Marketing, effective immediately.

Dow Corning newest moldable optical silicone expands options for more reliable LEDs

11/19/2013  Dow Corning introduced new Dow Corning MS-2002 Moldable White Reflector Silicone here at Strategies in Light Europe 2013.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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