LEDs

LEDS ARTICLES



CEA-Leti wins Avantex Innovation Prize for E-Thread technology

06/10/2013 

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.

Flexible display market to reach nearly 800 million unit shipments by 2020

06/06/2013 

Demand for flexible displays is set to undergo massive growth during the next seven years, with a broad variety of applications—ranging from smartphones to giant screens mounted on buildings—driving a nearly 250 times expansion in shipments from 2013 through 2020.

Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Solid-state lighting expert Bernhard Stapp named to board of Aledia

05/22/2013 

Aledia today announced that solid-state lighting (SSL) industry veteran Dr. Bernhard Stapp has joined its board of directors.

Printed, flexible and organic electronics sees 15.2% CAGR over the next decade

05/17/2013 

The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds that the total market for these technologies will grow from $16.04 billion in 2013 to $76.79 billion in 2023.

GT Advanced Technologies acquires Thermal Technology LLC

05/16/2013 

GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.

LED ingot market to reach $325M by 2015

05/07/2013 

The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).

EMS debuts low-cost conductive LED die attach adhesive

04/29/2013 

Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Hitachi launches brand-new GaN-template product

04/26/2013 

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.

AMOLED panel shipments get boost from premium smartphones

04/25/2013 

Demand for 4-inch or larger AMOLED panels has continued to increase in the fourth quarter of 2012 thanks to strong growth in the market for high-end smartphones with large screens, such as the Galaxy S and Note series by Samsung Electronics.

Samsung introduces new, high efficacy chip on board LED packages

04/22/2013 

Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.

AMOLED panel makers: To chase or to lead, that is the question

04/19/2013 

In recent years, TFT-LCD technology has dominated the display panel market, everything from small, medium and large screens, to the point where all other rival display technologies such as e-paper, PDP, and CRT have steadily been losing their positioning.

Flexible OLED lighting developments in East Asia

04/16/2013 

OLED lighting developments are taking place worldwide, with a lot of the research focused on phosphorescent OLED materials, which have a theoretical luminous efficacy four times higher than fluorescent materials.

Cambrios opens Japan office

04/11/2013 

Cambrios Technologies Corporation, a developer of nanowire-based solutions for the transparent and flexible conductor markets, today announced the establishment of its branch office in Tokyo, Japan, and the appointment of Takashi Murayama as Country Manager for Japan.

Memory, foundry and LED markets drive fab spending in southeast Asia

04/11/2013 

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.

US TV market set for second consecutive year of decline in 2013

04/09/2013 

U.S. television shipments are forecast to decline for a second year in a row in 2013, but growth will resume next year as the liquid crystal display television (LCD TV) segment regains some of the strength it had lost in the past year.

Plessey is first to release GaN on silicon LEDs

04/08/2013 

Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.

University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

04/05/2013 

A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.

Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy

04/04/2013 

Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.

Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture

04/03/2013  p>Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its program with Aledia, its nanowire-LED partner.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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