LEDs

LEDS ARTICLES



Laser diode researchers order Oxford Instruments ion beam depo tool

08/23/2012 

Optoelectronics researchers at the Ferdinand-Braun-Institut ordered an Optofab3000 for Laser Bar Facet Coating from Oxford Instruments Plasma Technology.

Technology licensing company Rambus restructures, creates CTO role

08/23/2012 

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.

New tool performs metal dicing, scribing for LED manufacturing

08/23/2012 

JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.

GaAs faces slowing demand from 2011 on

08/22/2012 

H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.

Dynamic changes impacting advanced electronic materials industry

08/22/2012 

Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.

Samsung and LED maker OSRAM settle patent disputes globally

08/20/2012 

OSRAM AG and Samsung Electronics Co., Ltd. have reached an agreement to settle all patent suits between them worldwide. The parties have reached license agreements for their respective LED patent portfolios.

LED researchers in China order AIXTRON MOCVD tool

08/17/2012 

Jilin University China has installed an AIXTRON CCS MOCVD 3 x 2” wafer configuration system for GaN UV and white LED research.

LED maker Epistar plans takeover of subsidiary

08/15/2012 

LED maker Epistar will completely take over its subsidiary Huga Optotech, which produces LED wafers and chips, through a share swap.

Kulicke & Soffa drives semiconductor packaging tool quality with new CQO

08/15/2012 

Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa

Printing methodologies for various electronic devices

08/14/2012 

Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.

OSRAM lays foundation for LED plant in China

08/13/2012 

OSRAM AG, LED manufacturer, laid the foundation for its Wuxi, China, plant, in a ceremony attended by high-ranking representatives of the Jiangsu province.

LEDs to get backlighting market share help from rising CCFL costs

08/13/2012 

In 2011, LEDs were expected to grab market share from CCFLs in the display backlighting segment. However, prices for CCFL-backlight TVs fell alongside prices for LED-backlit TVs. Now, CCFL raw materials costs have exploded, setting the stage for market share grabs by LEDs, albeit later than expected, reports Jimmy Kim, DisplaySearch.

Albermarle expands MOCVD materials production with Korean plant

08/10/2012 

Albemarle will expand its facility in Yeosu, Korea, with additional manufacturing capacity for PureGrowth products for MOCVD processes.

How to reduce large-size AMOLED display fab costs

08/09/2012 

AMOLED displays are growing rapidly and offer many performance benefits over LCDs. However, 55” AMOLED TV displays cost 8-10x as much as a comparable LCD to manufacture. NPD DisplaySearch looks at ways to improve costs/fab.

AIXTRON tool supports OTFT, OLED, other organic electronics manufacturing

08/09/2012 

AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.

What Cree's record Q4 means for the LED industry

08/09/2012 

Cree saw 8% quarter-to-quarter growth in FY2012 Q4, but only 2% growth in its LED component business. Reasons could include customer pushback from Cree's move into their space, lower average selling prices for LED chips, and more efficient LED modules that use fewer chips.

LED industry will change significantly as lighting takes off

08/08/2012 

The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.

OLED materials ramp to $7B in 2019

08/07/2012 

With OLED adoption, the total market value of materials used in OLED applications will grow quickly from about $500 million in 2012 to over $7 billion by the end of 2019, reports NanoMarkets.

Rubicon orders Zeta 300 optical profilers for sapphire LED substrates

08/06/2012 

Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.

Panasonic reorgs R&D along medium-, long-term roadmaps

08/03/2012 

Panasonic Corporation (NYSE:PC, TOKYO:6752) will reform its head office and governance as of October 1, aiming to reduce internally focused work and focus on customer needs.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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