LEDs

LEDS ARTICLES



Siemens to spin off LED and lighting subsidiary OSRAM

08/02/2012 

Siemens will publicly list OSRAM via a spinoff to Siemens shareholders, rather than an IPO. Spinning off OSRAM will make the public listing more independent of capital market conditions.

ITO alternatives for transparent conductors: From nanotubes to ZnO, adoption varies

08/01/2012 

Most firms offering alternatives to ITO focus on the touch-screen sensor market; however, this sector is too small for many of these firms to generate significant revenues. NanoMarkets outlines the various ITO alternatives, and their possible application spaces.

As LED growth switches from backlights to home lamps, phosphors gain importance

07/31/2012 

NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.

LED encapsulants grow with increased LED adoption

07/31/2012 

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.

Toshiba plans GaN-on-Si LED production line in Japan

07/30/2012 

Toshiba will start mass production of white LEDs on a new 200mm wafer production line in its Kaga Toshiba Electronics Corporation fab in northern Japan.

Plessey invests in GaN-on-Si HB-LED production, adds AIXTRON reactor

07/30/2012 

Plessey Semiconductors is installing a multi-million pound HB-LED production line at its Plymouth, UK facility, including a new AIXTRON reactor.

FUJIFILM sells OLED patent portfolio to Universal Display for $105M

07/26/2012 

FUJIFILM sold its 1,200+ OLED patents and patent applications to Universal Display for $105 million, with the companies embarking on a strategic relationship in this technology space.

AIXTRON debuts GaN-on-Si MOCVD reactor technology

07/26/2012 

AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.

2012 smartphone displays forecast lowered, but display type matters

07/26/2012 

DisplaySearch has lowered its 2012 mobile phone displays forecast from 1,917 million units to 1,729 million units. Comparing last quarter's forecasts and actual shipment results by technology, NPD DisplaySearch found that AMOLED actually had higher growth, but other technologies showed declines.

OLEDs World Summit agenda doubles focus on lighting

07/25/2012 

Panasonic, LG Chem and Philips are among the presenters for the upcoming 14th annual OLEDs World Summit, September 26-28, in San Francisco, CA.

Polarizer film trends: AMOLED growth, and acrylics move in

07/25/2012 

Polarizers used in display manufacturing will form a $9.94 billion market in 2012, up 4% from 2011, according to Displaybank. Sequentially, the polarizer market decreased by 9% in Q1 2012, hitting 2.235 billion. This was down 6% from Q1 2011.

SiC manufacturing: Patents don’t equal revenue/market share, and watch for challengers to PVT growth

07/24/2012 

SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.

Present on LEDs at Strategies in Light 2013

07/23/2012 

Strategies in Light 2013 will take place February 12-14 in Santa Clara, CA, hosted by PennWell Co.’s Strategies Unlimited and LEDs Magazine. The event’s theme is “Exploring the Growth Opportunities in the LED and Lighting Markets.”

Tier-1 LED makers see high utilization, but MOCVD demand won’t leap

07/20/2012 

Maxim Group analyzed MOCVD utilization and revenues at LED makers in Taiwan, finding that MOCVD orders are placed just to maintain capacity, not add, and high utilization rates are only at the top LED makers.

LED cost and manufacturing topics of Veeco LED maker gathering in Taiwan

07/20/2012 

Veeco hosted more than 150 LED manufacturers and customers of its MOCVD products recently during its MOCVD User Meeting in Taiwan. The talks largely focused on reducing LED cost through manufacturing, as well as using silicon as an LED substrate.

PANL, Plextronics expand OLED partnership to cover hole injection, transport materials

07/20/2012 

Universal Display broadened its work with Plextronics to accelerate the development and commercialization of solution-based OLED material systems. They will combine Plextronics’ hole injection and hole transport materials with Universal Display’s phosphorescent OLED emissive layer materials.

Osram devises LED solder pad concept for easier second sourcing

07/19/2012 

Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon LED component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.

Avnet opens US light lab for LED measurement and testing

07/17/2012 

Avnet Electronics Marketing Americas, part of Avnet Inc. (NYSE:AVT) opened a lighting lab in Chandler, AZ, to measure LED properties for various applications.

LED phosphor supplier Intematix plans IPO

07/17/2012 

Intematix Corporation, phosphor and phosphor component developer for LEDs, plans to conduct a registered initial public offering (IPO) of its common stock.

LEDs revenues grow even as prices fall through 2016

07/16/2012 

LED prices are declining, as revenues are growing through 2016, according to a report from Strategies Unlimited. Trends include multi-chip packaging and different LED power levels for different applications.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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