LEDs

LEDS ARTICLES



Guide to LED and OLED programs at SEMICON West

06/28/2012 

SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.

Canon intros lithography stepper for high-volume MEMS and LED production

06/27/2012 

Canon Inc. launched the FPA-3030i5+ i-line stepper for manufacturing MEMS and energy-efficient “green” devices such as power semiconductors in solar and wind applications and LEDs.

Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

06/26/2012 

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.

JPSA picosecond laser micromachining platform reduces debris and thermal damage

06/26/2012 

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.

Sony, Panasonic combine OLED manufacturing expertise to achieve large-panel, low-cost fab

06/25/2012 

Panasonic and Sony will combine their core and printing technology to jointly develop next-generation organic light-emitting diode (OLED) panel and module manufacturing technology.

MIT team models electronic behavior of OLEDs and other organic electronics

06/22/2012 

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.

LED manufacturing equipment status report

06/21/2012 

To support the next cycle of LED manufacturing, tools such as MOCVD, plasma etch, lithography, and others must undergo cost efficiency and yield improvements, says Yole Développement. Trends include migrating to larger wafers, silicon substrates, and tools developed specifically for LED fab, rather than retooled from semiconductor manufacturing specs.

PLANSEE ultra-smooth tungsten crucibles yield more sapphire wafers for LED fab

06/20/2012 

PLANSEE has developed a pressed-sintered tungsten crucible with an ultra-smooth surface to avoid sapphire ingot or crucible damage in the Kyropoulos method.

LUXeXceL, LTI Optics enable "digitization" of lighting optics

06/20/2012 

LTI Optics’ Photopia Parametric Optical Design Tools module enables creation of optical designs to achieve a prescribed distribution of light. LUXeXcel introduced its one-step 3D Printoptical printing process for plastic optics for lighting fixtures, which can create custom optics from the LTI Optics' CAD model at prices competitive with injection molding.

Silicon chip-on-board LED substrate enables best thermal dissipation

06/18/2012 

Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.

ECTC

06/15/2012 

Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.

Luminus Devices cuts LEDs’ thermal resistance 30% with new packaging

06/14/2012 

Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.

Metrology merger: MicroSense acquires SigmaTech

06/13/2012 

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.

Low LED prices, subsidy’s role, and MOCVD update from China

06/13/2012 

Guangzhou (China) Lightfair Conference is the biggest lighting fair in Asia. Citi analyst Timothy Arcuri notes trends in LED manufacturing and pricing ahead of China’s subsidy program going into effect.

Cree opens LED technical eval centers in China

06/13/2012 

Cree Inc. (Nasdaq:CREE) is opening new technology centers in Shenzhen and Shanghai, China, expanding Cree TEMPO (Thermal, Electrical, Mechanical, Photometric, Optical) Services for LED lighting manufacturers evaluating LED luminaires.

Lattice Power ramps high-power GaN-on-Si LED production

06/12/2012 

Lattice Power Corporation started volume production of its new-generation gallium nitride (GaN) high-power LEDs on silicon substrates.

High Tech Lights "reshores" LED manufacturing and R&D jobs

06/12/2012 

High Tech Lights is participating in a “Reshoring Initiative” by bringing job positions from China to the US for LED and laser diode scientists, manufacturing and assembly workers, and R&D staff.

PANL hits white OLED performance record

06/11/2012 

Universal Display Corporation (NASDAQ: PANL) announced record-breaking performance of its white organic light-emitting diode (OLED) lighting technology.

LED wafer prices stabilize with more suppliers and steadier demand

06/11/2012 

A balance of LED demand and supply in 2012 is based on the downward-stabilized price of sapphire wafers. More ingot suppliers are coming online, with new entrants in Korea and China, providing a broader supplier base for LED makers, shows Displaybank.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts