LEDs

LEDS ARTICLES



Veeco adds high-performance, compact MOCVD tools to TurboDisco line-up

06/07/2012 

Veeco Instruments added 3 new models of its TurboDisc MOCVD systems for HB-LED production: TurboDisc MaxBright M and MHP, and TurboDisc K465i HP.

Universal Display intros novel emission layer systems for OLEDs

06/05/2012 

Universal Display Corporation (NASDAQ: PANL) introduced new red, green, and yellow UniversalPHOLED products, combining UniversalPHOLED emitter materials with novel host systems.

LED package sales to increase but revenues will stay flat until 2014

06/04/2012 

Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.

LED manufacturer Marl taps DEK for print tool

06/03/2012 

LED specialist Marl will install the DEK Horizon 03iX print platform to adapt to new circuit board size requirements, and will use the VectorGuard stencil system and Nano-ProTek.

NXP develops GaN-on-Si for power semiconductors with Singapore’s A*STAR

06/01/2012 

A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.

PVD process generates 10" AlN-on-sapphire template wafer at Kyma

06/01/2012 

Kyma Technologies demonstrated a 10" AlN on sapphire template, manufactured on its plasma vapor deposition on nanocolumns technology. The 10” sapphire substrate was provided by Monocrystal.

Osram plans LED packaging facility in Wuxi

06/01/2012 

OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.

Novaled's new OLED materials set could double OLED lifetimes

05/31/2012 

Novaled debuted a class of n-doped electron transport layer (ETL) materials for OLED TV and mobile displays.

CNTs produced with >95% semiconducting content now available from SWeNT

05/31/2012 

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.

Largest flexible OLED display fabbed with mixed-oxide TFT

05/30/2012 

The Flexible Display Center at ASU, in conjunction with Army Research Labs scientists, manufactured what it is reporting as the world's largest flexible, full-color OLED display prototype. FDC used advanced mixed-oxide TFTs to build the 7.4” device.

Phosphor market expands as LEDs move into lighting applications

05/30/2012 

Phosphors used in LED lighting applications will see a market increase to over $1.6 billion by 2019, says NanoMarkets. Phosphors help control LED luminous efficacy and color to bring the technology on a level with traditional lighting.

90%+ utilization rates at LED makers in Taiwan: A short-term phenomenon

05/29/2012 

Barclays Capital’s analysts say that the LED industry remains in oversupply, and 90%+ utilization rates being reported in Taiwan’s LED fabs are a short-lived event.

Intel forms Collaborative Research Institutes to build global tech research community

05/26/2012 

Intel will invest more than $40 million over the next 5 years in a worldwide network of university research centers called "Intel Collaborative Research Institutes." Academia -- in hub and spoke universities -- will collaborate with industry on technology R&D.

How emerging growth sectors impact the overall semiconductor industry: ConFab preview

05/24/2012 

Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”

LEDs outshine legacy lighting business structure at LightFair 2012

05/24/2012 

“LED is now the dominant force in lighting for the foreseeable future,” reports Ted Konnerth of Egret Consulting Group, after LightFair 2012. What does that mean for traditional lighting products, applications, distribution channels, and talent?

EpiGaN opens GaN-on-Si wafer production at new site

05/23/2012 

EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.

JEDEC creates LED test standards series

05/23/2012 

JEDEC Solid State Technology Association created a series of standards, JESD51-5x, for component-level testing of high-brightness/power LEDs.

Indium expands electronics materials manufacturing with new facility in NY

05/23/2012 

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.

Quantum dots to see 55% 10-year CAGR on LED, display, healthcare, other applications

05/22/2012 

Quantum dots will grow to a $7480.25 million market by 2022, at a ten-year CAGR of 55.2%, according to Electronics.ca Publications.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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