03/14/2012 

Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.

03/13/2012 

Intematix, phosphor and phosphor component maker for high-quality LEDs, received $16.2 million in funding from Draper Fisher Jurvetson and Crosslink Capital, as well as a new financial investor.

03/09/2012 

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.

03/09/2012 

Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.

03/09/2012 

PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in light-emitting diodes (LEDs).

03/08/2012 

AIXTRON received a new MOCVD systems order from existing customer Quantum Wafer Inc., China. The 3 additional MOCVD units will process HB-LED wafers based on GaN materials.

03/07/2012 

Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.

03/07/2012 

The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.

03/06/2012 

Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.

03/06/2012 

The market volume for HB-LEDs reached $12 billion in 2011, a 4.3% growth over 2010, reports EPIC, The European Photonics Industry Consortium.

03/02/2012 

The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.

03/02/2012 

Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.

03/01/2012 

Dynamic changes in the FPD industry range from new LCD, AMOLED, touch, and flexible technologies to the emergence of China as the leading consumer and manufacturer of display products. FPD China covers the entire industry supply chain.

03/01/2012 

OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output, with a 25% efficiency increase over previous-generation LEDs.

02/29/2012 

Gamma Scientific developed the Bi-Spectral Fluorescence Spectroradiometer to quickly obtain detailed fluorescence data for LED phosphors and other fluorescent or reflective materials.

02/29/2012 

Epistar installed its first AIXTRON SE CRIUS II-XL system in a 19 x 4" wafer configuration to mass produce ultra-high-brightness (UHB) blue and white LEDs.

02/28/2012 

The formal announcement of China's light emitting diode (LED) subsidy program, likely in the first half of March, may drive tool utilization expansions for LED chip makers, reports Barclays Capital.

02/27/2012 

Cleantech Solutions International has delivered two units of sample sapphire chambers and one unit of a solar furnace to an international customer.

02/27/2012 

UL has been named a Zhaga-authorized LED testing center. Zhaga standards cover the physical dimensions, as well as the photometric, electrical and thermal behavior of LED light engines.

02/24/2012 

A team of scientists at Los Alamos National Laboratory has developed a process for creating glass-based, inorganic LEDs that produce light in the UV range.