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LEDS ARTICLES



GTAT wins 6" sapphire ingot order from LED substrate maker

02/10/2012 

GT Crystal Systems will supply 500,000 TIE 6" C-plane sapphire cores to Silian, which produces high-quality sapphire substrates for HB-LED manufacturing.

Lithography, direct-attach LEDs, packaging trends at Strategies in Light Day 3

02/10/2012 

Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.

LED cost reduction to come from manufacturing: Strategies in Light

02/10/2012 

The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.

Rubicon re-ups sapphire wafer contract with largest customer

02/09/2012 

Rubicon Technology, Inc. (RBCN) entered into a new contract with its largest customer for large-diameter sapphire wafers. Shipments will total at minimum $20 million.

AIXTRON MOCVD tools easier to lease in China with new MSFL alliance

02/09/2012 

Minsheng Financial Leasing (MSFL), China's main non-banking financial institution, formed a strategic alliance with AIXTRON, making fab tool leasing options available to AIXTRON's customers in China.

LED manufacturing highlights from Strategies in Light Day 2

02/09/2012 

Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.

2012 Flexible Electronics & Displays: The future is flexible

02/08/2012 

Printed flexible electronics represent the future of sensors, displays, power electronics, and lighting, according to experts at the FlexTech Alliance 2012 Flexible Electronics & Displays Conference & Exhibition.

Seoul Semiconductor keynote at Strategies in Light: Highlights

02/08/2012 

Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor keynoted at Strategies in Light today. Lee’s keynote, "A View from Seoul," marked the first time a Korean LED maker has spoken at the conference. Following are highlights from his talk.

Large-diameter sapphire LED substrates on-trend at Strategies in Light

02/08/2012 

Raja Parvez, president and CEO of Rubicon Technology (RBCN) will speak about the "Move to Larger Diameter Sapphire Substrates" at the Strategies in Light today during the LED Manufacturing track.

Cree's new silicon carbide (SiC) platform cuts initial LED cost

02/08/2012 

Cree Inc. (Nasdaq:CREE) reports doubling the lumens/dollar of light emitting diodes (LEDs) with its new silicon carbide (SiC) LED substrate technology.

Top 10 LED manufacturers in 2011, and shifting regional dominance

02/08/2012 

The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.

UPDATED: Record semiconductor sales in 2011, 2012 outlook

02/08/2012 

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.

JPSA expands Ultrafast laser machining technology

02/08/2012 

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.

Strategies in Light: Day 1, LED Lighting Report, New Start-ups

02/08/2012 

The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.

USSOCOM awards eMagin $1M+ to optimize OLED micro display for mass production

02/07/2012 

eMagin was awarded a $1.12 million SBIR contract from the United States Special Operations Command (USSOCOM) to optimize its WUXGA OLED micro display for mass production.

Plessey acquires CamGaN for GaN-on-Si LED technology

02/07/2012 

Plessey has acquired CamGaN, a University of Cambridge spin-out with novel GaN technology for HB-LEDs on large-area silicon substrates. Plessey will bring the technology into its 6" wafer processing facility in the U.K.

EVG LED mask aligner offers COO improvement in gen-2

02/07/2012 

EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.

SemiLEDs, LG Siltron, Epistar install Veeco MOCVD tools

02/07/2012 

Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.

Kodak, Heraeus projected capacitive touch screen showcases ITO alternative

02/06/2012 

Eastman Kodak and Heraeus Precious Metals will demonstrate a 3.5" touchscreen panel for cell phone applications using Kodak HCF-225 Film/ESTAR Base as the transparent conductive component at Flexible Electronics & Displays 2012.

Corning, Samsung Mobile Display form OLED glass substrate venture

02/03/2012 

Corning Incorporated (NYSE:GLW) and Samsung Mobile Display Co. Ltd. will establish a new equity venture for the manufacture of specialty glass substrates for organic light emitting diode (OLED) devices.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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