LEDs

LEDS ARTICLES



LED lighting increases power electronics complexity, drives new power supply market

02/03/2012 

"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.

Hanwha moves to manufacture ElectriPlast moldable conductive plastic

02/03/2012 

Hanwha L&C of Korea signed a letter of intent to obtain manufacturing and distribution rights to ElectriPlast from Integral Technologies Inc, hybrid conductive plastics maker. The LOI is applicable for various parts of Asia.

Can carbon nanotubes fluoresce fully?

02/02/2012 

Rice University studied the fluorescence of single-walled carbon nanotubes (SWCNT) in new research, finding that the lengths and imperfections of individual nanotubes affect their fluorescence.

Soitec advances LED strategy with Altatech Semiconductor buy

02/01/2012 

Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.

Novaled achieves ISO 9001:2008 quality certification

02/01/2012 

Novaled AG has been certified according to the ISO 9001:2008 international quality management standard by external auditors DQS GmbH.

Cambrios takes ITO-alternative to strategic phase with Samsung investment, new leader

01/31/2012 

Cambrios Technologies Corporation appointed John LeMoncheck as president and CEO, and announced a $5 million Series D-3 financing round from Samsung Venture Investment Corporation.

Heraeus thick film division renames insulated aluminum materials system Celcion

01/31/2012 

The Thick Film Division of Heraeus announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows LED circuits to run cooler than MCPCBs.

Gamma Scientific uncrates LED tester

01/30/2012 

Gamma Scientific introduced a low-cost spectrometer for quick and accurate testing for LEDs. The RadOMA Lite linear CCD array spectrometer tests LED intensity and total flux. 

MOCVD cools down, LED downstream processing heats up

01/30/2012 

Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.

MicroOLED OLED micro-display reaches 5.4M-pixels on 0.61" panel

01/27/2012 

Near-eye micro-display maker MicroOLED introduced a 5.4-million-pixel-density, 0.61"-diagonal, low-power-consumption organic light-emitting diode (OLED) microdisplay on silicon.

Umicore consolidates germanium optics production to US

01/26/2012 

Umicore will consolidate production of its germanium-based optics products in the US, citing a majority market in the country. Umicore will phase out optics production in Olen, Belgium.

USPTO seeks nominees for National Medal of Technology and Innovation

01/24/2012 

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."

Soitec, Sumitomo Electric scale GaN engineered wafers to 6"

01/24/2012 

Soitec (Euronext) and Sumitomo Electric Industries Ltd. demonstrated 4" and 6" engineered gallium nitride (GaN) substrates, and launched pilot production lines to enable wider market adoption.

AMOLED TV manufacturing status, price trends

01/24/2012 

AMOLED TVs drew a crowd at CES, but manufacturing challenges and expensive fab materials will limit global shipments of the sets for several years, says IHS iSuppli. IHS compares the 55" AMOLED TVs from LG Display and Samsung, each using different manufacturing technologies.

Seoul Semiconductor LED patents top 10K mark

01/20/2012 

Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.

AIXTRON sells SiC CVD tool to United Silicon Carbide

01/20/2012 

USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.

imec launches flexible OLED display manufacturing research with Holst Centre

01/19/2012 

imec and Holst Centre, with associated industry partners, are developing flexible active-matrix OLED display technology, the associated drivers and circuits, and new manufacturing equipment to build the displays, all with an eye on low-cost and high-volume production.

Annealsys MOCVD tool integrates Hine Automation vacuum wafer transfer system

01/19/2012 

Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.

SEMI award honors quantum dot research at QD Vision

01/18/2012 

SEMI presented its annual SEMI Award for North America to QD Vision. QD Vision team members made significant progress on the integration and manufacturing processes essential to the commercialization of quantum dot (QD) technology.

Cheaper LED backlights require LED, plate materials changes

01/18/2012 

Consumers are adopting LED-backlit LCD TVs more slowly than expected, prompting TV makers to design lower-power, lower-cost LED backlights using fewer LEDs per TV set, shows the NPD DisplaySearch Quarterly LED Backlight Report.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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