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LEDS ARTICLES



LED packaging equipment debuts at ESI booth: Via drilling and wafer scribing tools

07/14/2011 

ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.

LED makers shifting focus from efficacy to manufacturing efficiency for mass-market leap

06/29/2011 

SEMICON West preview: With device efficacy approaching limits and end-costs still too high for mass-market adoption, LED manufacturers are looking to trim costs by improving key manufacturing steps: measuring process conditions, preparing and handling substrates, and wafer-level testing.

LED adoption pushes driver IC changes and growth

06/28/2011 

As LED adoption continues to grow, LED driver ICs face pressure from increased IC integration, driver-less AC-LEDs and other technologies, and falling prices. However, the driver IC unit can bring performance and power enhancements that consumers want for LED lighting adoption.

LED manufacturers need dedicated toolset and cost savings

06/27/2011 

Until now, LED makers used retrofitted IC equipment and materials. Yole predicts that the market has enough sway now to attract dedicated toolsets for LED fab and packaging. LED growth will not be boring, however, as a few mini down-/up-turn cycles will occur through 2016.

OPV, OLEDs headline at LOPE-C 2011

06/10/2011 

The Large Area, Organic and Printed Electronics Convention (LOPE-C) conference and exhibition, June 28-30 in Frankfurt, Germany, will focus largely on organic photovoltaics (OPV) and organic light emitting diodes (OLEDs).

OLED materials progress at Universal Display advances print/deposition fab method

04/26/2011 

Universal Display Corporation (NASDAQ: PANL) announced advances in the performance of its UniversalP2OLED solution-processible, phosphorescent OLED material systems for use with solution-based manufacturing processes (such as ink-jet printing).

MRS Spring 2011: Lighting the paths for LED materials

04/26/2011 

Michael A. Fury looks at papers from the opening day of this year's MRS Spring meeting, including various takes on light-emitting devices, nanotubes for optoelectronic devices, and switching behavior of ultrathin films.

Asian FPD maker orders Cymer TCZ Gen5.5 crystallization systems

04/19/2011 

TCZ, Cymer Inc. (Nasdaq: CYMI) display equipment product division, received a volume order for the TCZ-1500B Gen 5.5 crystallization system from a leading Asian flat panel display manufacturer. This is TCZ's second volume order in 2011 and fourth tool customer.

Large OLEDs top lists in China

04/07/2011 

Small-sized OLEDs are mature, now that rapid adoption has occured in the mobile phone sector. With technical advances and mass production processes, larger-sized OLEDs will come to the fore, according to CCID Consulting. Advancements are needed in the areas of process equipment and driver IC technology for China to become an OLED leader. CCID and NanoMarkets summarize their OLED market assessments for China, Japan, and Korea.

HB LED packaging materials pros and cons

04/01/2011 

LEDDaniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.

LCD-OLED-manufacturing-equipment-on-a-growth-tear

04/01/2011 

With escalating demand for larger fabs of Gen 8, Gen 8.5 and Gen 10, the liquid crystal display (LCD) and organic light emitting diode (OLED) manufacturing equipment market has witnessed a growth spur, which could last 7 years, says Frost & Sullivan.

LED-test-standards-talk-with-Poppe-MENT

03/23/2011 

Comprehensive LED testing. SOURCE: Mentor GraphicsAndrás Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.

LED-maker-taps-Oxford-Instruments-for-etch-deposition

03/21/2011 

The Optogan Group placed a multi-system order for Oxford Instruments' etch and deposition systems. These include PlasmaPro System133 ICP and PlasmaPro 800Plus RIE etch systems, and a PlasmaPro 800Plus deposition system. 

K&S high volume fine pitch Cu wire bonding

02/23/2011 

Figure. Copper transition and roadmap planning. SOURCE: Kulicke & SoffaAs gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).

Veeco GaN MOCVD tool debut

02/17/2011 

Veeco's TurboDisc MaxBright MOCVD, LED TV penetration Veeco Instruments' new TurboDisc MaxBright GaN MOCVD multi-reactor system is poised to take advantage of what the company believes is an accelerated rate of LED TV penetration. The new system targets manufacturing of HB-LEDs and is capable of single- or multi-chamber layer growth.

Palomar discusses high volume HB LED assembly at Strategies in Light

02/11/2011 

Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.

UNH startup Innovacene wins $100K OLED grant from NHIRC

02/03/2011 

The NH-ICC has attracted a $100,000 grant from the NHIRC to help commercialize semiconductor technology developed by startup Innovacene.

HBLED Manufacturing: Gearing Up

02/01/2011  Peter Singer, Editor-in-Chief

Semi LED fab capacity: Cause for concern, says Dieseldorff, SEMI

01/28/2011 

Semiconductor/LED fab capacity analysis 2011Speaking at SEMI’s Industry Strategy Symposium, Christian Dieseldorff, SEMI senior analyst, provided an in-depth look at fab construction, capacity, and capex in 2011 and 2012. In this podcast, Dieseldorff walks listeners through fab construction projects by region and device type (LED, non-memory, memory, etc.)

Semiconductor fab to make InGan solar cells for BluGlass

01/07/2011 

BluGlass (ASX:BLG) has commissioned the foundry services of  Rainbow Optoelectronics Materials Shanghai to provide device fabrication and processing services for the purposes of creating a nitride solar cell prototype designed by BluGlass.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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