Lithography

LITHOGRAPHY ARTICLES



2018: Big changes in mask manufacturing and what it means for mask models

03/01/2018  There are big changes on the horizon for semiconductor mask manufacturing, including the imminent first production use of multi-beam mask writers, and the preparation of all phases of semiconductor manufacturing for the introduction of extreme ultra-violet (EUV) lithography within the next few years.

Samsung Electronics breaks ground on new EUV line in Hwaseong

02/28/2018  Construction will be completed in the second half of 2019 and ready for production in 2020 Samsung aims to maintain its leadership in cutting-edge process technology under 7nm.

imec and Cadence tape out industry's first 3nm test chip

02/28/2018  Extreme ultraviolet and 193 immersion lithography technology and Cadence digital tools used to design 3nm CPU core.

imec announces advances in EUV lithography

02/26/2018  Imec presents initial electrical results on N5 32nm pitch metal-2 layer.

North American semiconductor equipment industry posts January 2018 billings

02/23/2018  "The strong billings levels from late 2017 have carried over into the new year," said Ajit Manocha, president and CEO of SEMI.

Supermicro expands its Silicon Valley corporate headquarters

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

Gigaphoton ships latest ArF Excimer Laser GT65A

02/22/2018  In January, Gigaphoton Inc., a major manufacturer of lithography light sources, announced the shipment of an ArF Excimer Laser for advanced immersion exposure (lithography) devices, the "GT65A" Unit 1, as a new product that meets the growing demand for semiconductors in recent years.

Peter Trefonas elected SPIE Fellow

02/22/2018  Peter Trefonas, Ph.D., corporate fellow in Dow Electronic Materials, has recently been elected a Fellow of SPIE, for achievements in design for manufacturing and compact modeling.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

Cymer qualifies and ships new argon fluoride light source

02/21/2018  Cymer, a developer of lithography light sources used by chipmakers to pattern advanced semiconductor chips, today announced the first shipment of the newly qualified XLR 800ix light source that improves performance and productivity, as well as lowers cost-of-ownership for leading-edge argon fluoride (ArF) immersion lithography systems.

ASML welcomes Christophe Fouquet to Board of Management

02/20/2018  ASML Holding N.V. (ASML) today announces that its Supervisory Board intends to appoint Christophe Fouquet (44) as Executive Vice President to the Board of Management, subject to notification of the Annual General Meeting of Shareholders on 25 April 2018.

Top 10 semiconductor R&D spenders increase outlays 6% in 2017

02/20/2018  Intel far surpasses others with R&D spending of $13.1 billion in 2017 and accounts for 36% of expenditures among Top R&D spenders.

Technavio releases report on key findings of the global semiconductor IP market 

02/15/2018  The latest market research report by Technavio on the global semiconductor IP market predicts a CAGR of close to 10% during the period 2018-2022.

SEMI China President Lung Chu leads mayor roundtable discussion at International IoT Summit in Silicon Valley

02/14/2018  Yawning differences between cultures, economic systems and rules of law stand as barriers for many China- and US-based technology companies to do business on each other’s soil, making it imperative for both countries to work together to bridge the gaps that make it harder for tech businesses in each country to find partners and open markets in the other, SEMI China president Lung Chu said at a recent conference.

ASML increases its dominance of semiconductor lithography market in 2017

02/12/2018  ASML's dominance in the semiconductor equipment market continued in 2017, according to the report "Sub-100nm Lithography: Market Analysis and Strategic Issues," recently published by The Information Network.

Amkor Technology names Doug Alexander and MaryFrances McCourt to Board of Directors

02/09/2018  Amkor Technology, Inc. today announced that Doug Alexander and MaryFrances McCourt have been appointed as new members of the Company's Board of Directors. With these appointments, Amkor's Board has been expanded to twelve members.

Mass production of new class of semiconductors closer to reality

02/09/2018  Two Waterloo chemists have made it easier for manufacturers to produce a new class of faster and cheaper semiconductors.

New IC manufacturing lines to boost total industry wafer capacity 8%

02/08/2018  Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017.

SEMI forms Technology Communities to speed industry collaboration and innovation

02/08/2018  SEMI President & CEO Ajit Manocha has formed a new group, Technology Communities, to better collaborate, align, and enhance all of SEMI’s technology-focused activities by operating them under one umbrella.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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