Lithography

LITHOGRAPHY ARTICLES



Nanoimprint equipment companies set to make market impression

02/20/2003  The first generation of tools for molding tiny devices with nanoimprint lithography is on its way to market. NIL encompasses a variety of methods for stamping ultrasmall patterns and structures onto a surface. It could also serve as a low-cost alternative to the photolithography processes currently used to carve out MEMS devices, microfluidic systems and computer chips.

Nano-mask arrests growth of spore-forming bacteria

02/12/2003  FEB. 12--HENDERSON, Nevada--Emergency Filtration Products Inc. has received preliminary results from the testing of its nanotechnology-enhanced 2H Technology filtration system that will be integrated into an environmental isolation mask.

Shipley opens Advanced Technology Center

02/11/2003  FEB. 11--MARLBORO, Mass.--Shipley Company, LLC., has opened its Advanced Technology Center (ATC), a facility dedicated to the development of lithography, interconnect, low-k dielectric and other critical materials needed to produce new generations of microelectronic devices.

Shipley opens new Advanced Technology Center

02/05/2003  Feb. 5, 2003 - Marlborough, MA - Shipley Company LLC, has opened its Advanced Technology Center (ATC), a facility dedicated to the development of lithography, interconnect, low-k dielectric and other critical materials.

Vecco teams with SEMATECH on photomask technology

01/29/2003  JAN. 29--WOODBURY, N.Y.--Veeco Instruments Inc. has signed a joint agreement with International SEMATECH (ISMT) to utilize Veeco's NEXUS Low Defect Density (LDD) Ion Beam Deposition (IBD) System for the development of certain advanced manufacturing technologies required to fabricate next generation extreme ultraviolet (EUV) photomask technology.

SEMATECH, SUNY seal EUV lithography program deal

01/29/2003  JAN. 29--ALBANY, N.Y.--The University at Albany (UAlbany) and International SEMATECH (ISMT), the global consortium of semiconductor manufacturers, have completed negotiations on a joint five-year program to accelerate the development of next generation lithography.

IMEC begins construction of 300mm research fab

01/28/2003  Jan. 28, 2003 - Leuven, Belgium - IMEC's board of directors has announced the construction of a new 300mm cleanroom.

ISMT and UAlbany close deal on EUV lithography program

01/28/2003  Jan. 28, 2003 - Austin, TX, and Albany, NY - The U. at Albany (UAlbany) and International SEMATECH (ISMT), a global consortium of semiconductor manufacturers, have completed negotiations on a joint five-year program to accelerate the development of next generation lithography.

IMEC begins construction of 300-mm research fab

01/28/2003  JAN. 28--LEUVEN, Belgium--IMEC's board of directors says the company will move ahead with the construction of a new 300 mm cleanroom.

Seiko Instruments to join LEEPL consortium

01/20/2003  Jan. 20, 2003 - Tokyo, Japan - Seiko Instruments Inc. will join the LEEPL Technology Consortium, formed by a group of companies from Japan and overseas to develop technology for a next-generation stepper that uses an electron beam as the light source for lithography.

It's tool time for nanotech, and nPoint is on the cutting edge

01/13/2003  A small Wisconsin company is gearing up to become a big supplier of microscopic components for nanotech research and design. Its CEO estimates the market at $74 million per year, with an additional $35-million-per-year market in semiconductor chip lithography. Newer markets in nanotechnology for life sciences and defense hold additional promise.

Exclusive Feature: LITHOGRAPHY

Positive versus negative resist

01/10/2003  T.A. Brunner, C. Fonseca, IBM SRDC, Hopewell Junction, NY

Simulations imply that narrow resist lines print best with a positive tone resist process while narrow trench geometries are best with a negative tone process, even if the resist performance parameters are unequal. Simple development bias models appear to capture... MORE

Firms link on biological detection system

01/08/2003  Centrex Inc. and Emergency Filtration Products Inc. have teamed up to make and sell a complete biological detection system.

INFICON acquires New Vision Systems

01/07/2003  Jan. 7, 2003 - Syracuse, NY and Zurich, Switzerland - INFICON Holding AG, a manufacturer of vacuum instrumentation and process control software, has acquired the privately held company, New Vision Systems, a provider of APC and lithography analysis for semiconductor manufacturing.

SEMATECH urged to guide industry on immersion technology

12/18/2002  Dec. 18, 2002 - Austin, TX - More than 100 of the world's top lithography experts attending an International SEMATECH (ISMT) workshop to review the state of immersion lithography technology urged the consortium to help coordinate and accelerate a feasibility study on the technology.

Lithography equipment supplier ASML to cut 1,450 jobs

12/18/2002  Dec. 18, 2002 - Veldhoven, Netherlands - Chip equipment maker ASML has announced that it will cut 1,450 jobs and sell or close loss-making US businesses, as it strives to reach break-even in the chip industry's worst-ever slump.

Numerical Technologies licenses phase-shift technology to Samsung

12/17/2002  Dec. 17, 2002 - San Jose, CA - Numerical Technologies Inc., the provider of subwavelength lithography-enabling technology to the semiconductor industry, today announced that Samsung Electronics Co. Ltd. has signed an agreement to license Numerical's phase-shifting technology for the production of its newest and most advanced SRAM product.

ASML restructuring announcement expected

12/17/2002  Dec. 17, 2002 - Veldhoven, Netherlands - Lithography equipment supplier ASML Holding NV will shortly unveil details of a large restructuring program, according to a person close to the company.

UPDATE: EFP filtration system gets favorable report

12/13/2002  DEC. 13--HENDERSON, NEV.--Emergency Filtration Products Inc. (EFP) has received favorable preliminary results from the testing of its nanotechnology-enhanced 2H Technology filtration system, which will be incorporated into an Environmental Isolation Mask.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts