08/13/2002  Hillsboro, OR - Intel Corp. has unveiled several technology developments that it has integrated into its new 90nm process, which it says it has already used to build "record-breaking" silicon structures and memory chips.

08/09/2002  America's top general is urging small tech developers seeking Defense Department dollars to get out of the labs and make friends with the military's war fighters. "If you are in the research and development business … your best friends ought to be a bunch of operators," said the chairman of the Joint Chiefs of Staff. "Operators" means anyone putting together the war on terrorism's game plan.

08/08/2002  Aug. 8, 2002 - Tokyo, Japan - Dai Nippon Printing Co. and Hoya Corp. have penned a cooperative agreement in the field of mask blanks.

08/08/2002 

08/01/2002  Tokyo, Japan - Hoya Corp., an advanced glass products manufacturer, plans to establish a new company, Hoya Advanced Semiconductor Technologies Co. Ltd., at Akishuma-shi, Tokyo, for the development and production of silicon carbide wafers.

08/01/2002  We were young, some of us were barely out of high school, and it really didn't matter to us if the blood was visible or not

07/29/2002  RAVE LLC CEO Barry Hopkins attended the NanoBusiness Spring 2002 conference in hopes of discovering the next generation of customers and applications for his company's photomask-repair tools - hopefully customers in the emerging field of nanotechnology, which could possibly run counter-cyclical to the chip industry's peaks and valleys.

07/24/2002 

07/24/2002 

07/23/2002  A nano and microtechnology facility called FIRST – an acronym for Frontiers in Research, Space and Time – opened this month at the Swiss Federal Institute of Technology in Zurich. The first concrete products to emerge will be active photonic components, according to officials at GigaTera Inc., which is involved in one of the industrial/academic partnerships meant to commercialize research at the lab.

07/19/2002  New York Gov. George Pataki delivered a big steak Thursday to support the sizzle of turning New York's Capitol District into a "Tech Valley." SEMATECH North's goal: developing technology to drastically shrink chip components to less than 100 nanometers. Nanoscale chipmaking will also be the mother of invention for production equipment that will employ small technologies such as MEMS devices and tiny sensors.

07/18/2002  Austin, TX, and Albany, NY - Plans for a joint five-year $320 million program to accelerate the development of next generation lithography were announced by International SEMATECH (ISMT), a global consortium of semiconductor manufacturers, and the U. at Albany-SUNY (UAlbany).

07/16/2002  Nanotech researchers can move faster if they share information. That's why the French and U.S. governments are increasing cooperation. Private industries are doing it, too, but they're working together just long enough to get onto the playing field, then it's business competition as usual.

07/01/2002  The Bridgman-Stockbarger method of growing CaF₂ has been around for decades. Now that the semiconductor industry has an escalating need for the material - a "must have" for lens systems in 157nm lithography tools - debate has focused on the adequacy of supply and the technique used to obtain it.

06/24/2002  Quietly perking away in a small town in Switzerland is Mimotec, which expects to use income from sales of its micromachined metal parts to finance its current push into the microfluidic component market. In fact its CEO believes micromolds will be the company's best shot at the U.S. market.

06/24/2002  Princeton's Nanostructures Laboratory is on a roll, with two significant small tech advances announced in one week.

06/20/2002  June 20, 2002 - San Diego, CA - JMAR Technologies Inc., a developer and provider of compact point-source, laser plasma lithography systems and sources, has received a contract for $5.3 million from the US Army Robert Morris Acquisition Center in Adelphi, MD, to finance the completion of the first of its integrated proprietary point-source laser plasma lithography systems.

06/17/2002  June 17, 2002 - Round Rock, TX - DuPont Photomasks Inc. has signed an agreement with Cypress Semiconductor Corp. to jointly develop advanced photomask technologies supporting the production of high-performance ICs.

06/12/2002  June 12, 2002 - San Jose, CA - Samsung Semiconductor Inc. unveiled its first successful development of a next-generation wafer processing technology in which a hafnium dioxide-aluminum oxide laminate film is fabricated on the silicon wafer using Atomic Layer Deposition.

06/12/2002  Molecular devices are not ready to surrender yet, but this new breakthrough at Harvard and Cornell – the difficult technological trick of trapping a single atom between two contacts – gives scientists a clearer view of the process.