Lithography

LITHOGRAPHY ARTICLES



Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position

01/11/2018  Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to preliminary results by Gartner, Inc. Undersupply helped drive 64 percent revenue growth in the memory market, which accounted for 31 percent of total semiconductor revenue in 2017.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Process Watch: The (automotive) problem with semiconductors

01/11/2018  This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the challenges involved in the automotive supply chain. Future articles in the series will address specific process control solutions to those challenges.

New Multibeam patent enhances highly-localized precision material removal

01/10/2018  Multibeam Corporation today disclosed a new patent that describes the innovative use of e-beam technology for highly localized precision etching in manufacturing advanced memory and logic ICs.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

Surprising changes in semiconductor equipment market share in 2017

01/04/2018  Through three quarters of calendar year 2017, market shares of top semiconductor equipment manufacturers indicate large gains by Tokyo Electron and Lam Research.

SEMI names new SEMI Japan president

01/02/2018  SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan.

APAC tops the global mask alignment systems market

12/22/2017  The global mask alignment systems market is expected to grow at a CAGR of more than 9% during the forecast period, according to Technavio’s latest market research.

ISS Europe 2018 to focus on winning in the global marketplace

12/20/2017  Electronics manufacturing executives will sharpen their competitive edge in Dublin, Ireland, on 4-6 March at Europe's SEMI Industry Strategy Symposium (ISS Europe).

EVG completes latest phase of production capacity expansion at corporate headquarters

12/19/2017  Newly opened building with advanced cleanroom technology provides additional space for final assembly of EVG process equipment and technical source inspection by the company's global customers.

North American semiconductor equipment industry posts November 2017 billings

12/15/2017  North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

Industry enters the age of WOW

12/13/2017  The semiconductor industry has been there before, with large increases in investments followed by dramatic downturns. While the most dramatic downturns, 2001 and 2009, were due to, in a large part, acro-economic factors, the industry has typically observed one to two years of increased investment spending followed by a down period. This time around, the industry will achieve a “WOW” with three consecutive years of fab investment growth, a pattern not observed since the mid-1990s.

$55.9B semiconductor equipment forecast: New record with Korea at top

12/12/2017  Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition.

EVG installs low-temp plasma activation system at the University of Tokyo

12/12/2017  EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.

Leti integrates hybrid III-V silicon lasers on 200mm wafers using standard CMOS process

12/06/2017  Leti, a research institute of CEA Tech, has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow.

SEMI reports record quarterly billings of $14.3B

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

Broad 3Q 2017 growth - Both globally and in Europe

12/04/2017  The third quarter of this year has seen broad growth both globally and also for the European electronic supply chain.

GLOBALFOUNDRIES and Ayar Labs establish strategic collaboration to speed up data center applications 

12/04/2017  GLOBALFOUNDRIES and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, today announced a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.

Semiconductor industry continues upward trend toward record year

11/30/2017  The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit.

North American semiconductor equipment industry posts October 2017 billings

11/28/2017  North America-based manufacturers of semiconductor equipment posted $2.02 billion in billings worldwide in October 2017 (three-month average basis).




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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