Lithography

LITHOGRAPHY ARTICLES



New Products

11/01/2000  The NXR-1510 is a new full-featured, automatic X-ray inspection and quality assurance test system

AZ Electronic Materials licenses polymer platforms for 193-nm lithography

11/01/2000  Somerville, New Jersey--Nov. 1, 2000--AZ Electronic Materials, a business of the Clariant Corp., has licensed polymer platforms from both Fujitsu and Hyundai for its 193-nm photoresists. By leveraging these two polymer platforms, AZ plans to provide solutions for the first critical photoresist layers migrating to 193-nm technology.

Lithographers narrow NGL options

10/16/2000  Austin, Texas--Oct. 16, 2000--Lithographers attending a recent International SEMATECH Next-Generation Lithography (NGL) Workshop recommended that the global industry narrow the NGL options to two technologies--extreme ultraviolet (EUV) and electron projection lithography (EPL)--for commercialization.

Consortium Targets Debugging of Advanced Device Designs

09/28/2000  San Jose, California--Sept. 28, 2000--International SEMATECH, a consortium of semiconductor manufacturers, has chosen Knights Technology, a division of Electroglas, Inc., to commercially develop an advanced software tool for locating the physical origins of faults in integrated random-logic circuits.

Anadigics Adds Microlithography Equipment

08/23/2000  MINNEAPOLIS, Minn.--Aug. 23, 2000--FSI International announced that Anadigics Inc. has placed an order for an FSI microlithography system for use used to manufacture 6-inch GaAs wafers.

Photronics Completes Majority Investment in Mask Firm

08/16/2000  JUPITER, Fla.--Aug. 16, 2000--Photronics, a maker of photomasks, is the new majority owner of Precision Semiconductor Mask Corp.

Photronics Opens Advanced Reticle Characterization Center

08/15/2000  AUSTIN, Texas--Aug. 15, 2000--Photronics Inc. has opened its Advanced Reticle Characterization Center (ARCC) designed to meet the growing demand from semiconductor manufacturers and equipment suppliers working on technologies at and below the 0.13 ?m technology node.

Software-driven wirebonding

08/01/2000  New design tools promise to relieve setup bottlenecks by automating the documentation and validation work

JMAR Technologies To Develop X-ray Lithography System for U.S. Army

07/24/2000  SAN DIEGO, Calif.--July 21, 2000--JMAR Technologies Inc. has been awarded $3.8 million by the U.S Army to continue developing PXS laser plasma X-ray point-source technology for advanced semiconductor lithography applications.

Avant! Granted Optical Proximity Correction Patent

07/20/2000  FREMONT, Calif.--July 20, 2000--Avant! Corporation was awarded patent number 6,081,658 for their Proximity Correction System for wafer lithography.

Ultratech Named Exclusive Lithography Supplier by IEP/Casio

07/11/2000  SEMICON West '00--July 11, 2000--Ultratech Stepper Inc. has been awarded exclusive supplier status by IEP/Casio (Integrated Electronics & Packaging Technologies Inc.).

SVG Unveils New Lithography Systems, Receives 193-nm Order from Cypress Semiconductor

07/11/2000  SEMICON West '00--July 11, 2000--Fresh on the heels of two new product additions to its lithography portfolio, Silicon Valley Group (SVG) Lithography Systems has received an order for its Micrascan 193 step-and-scan lithography system from Cypress Semiconductor.

ASML Announces TWINSCAN 300mm Lithography Platform

07/10/2000  SEMICON West '00--July 10, 2000--ASML launches its first product from its new TWINSCAN 300mm photolithography platform, the AT:700S scanner.

Canon to Introduce Next-Gen Lithography Tools at SEMICON West

07/07/2000  SAN JOSE, Calif.--July 7, 2000--Canon is introducing its complete set of next-generation lithography tools at the SEMICON/West trade show.

Sony to Build Semiconductor Design Center for Broadband Applications

07/07/2000  PITTSBURGH, Penn.--July 7, 2000--Sony Electronics has announced plans to establish a semiconductor design center in Pittsburgh this fall to develop technologies for the broadband network.

Nova Measuring Instruments to Introduce Photolithography Tools

07/07/2000  SAN FRANCISCO, Calif.--July 7, 2000--Nova Measuring Instruments Ltd. will introduce a new dual-purpose integrated process control system for overlay registration measurement and full wafer macro defect inspection for photolithography manufacturing at the Semicon West show.

Exitech Selects Extraction Systems' Vaporsorb II Filters

07/06/2000  FRANKLIN, MA--June 22, 2000--Exitech Ltd. of Oxford, England has selected Extraction Systems' Vaporsorb II filter technology for its 157 nm exposure tool to conduct advanced optical lithography development. The company will conduct the research in association with lithography equipment suppliers at International SEMATECH.

Numerical Technologies, NPI to Collaborate on 248-, 193-nm Imaging Systems

07/05/2000  SAN JOSE, Calif.--July 5, 2000--An agreement to extend the life of available optical imaging systems has been struck between Numerical Technologies, a developer of subwavelength design solutions, and lithography equipment manufacturer Nikon Precision Inc. (NPI)

Mattson Technology Acquires STEAG Semiconductor Division and CFM Technologies

06/30/2000  FREMONT, Calif.--June 30, 2000--Mattson Technology has entered into definitive agreements to absorb STEAG Electronic Systems' AG Semiconductor Equipment Division and CFM Technologies. The STEAG purchase excludes STEAG's optical storage and photomask operations.

New Offerings From KLA-Tencor's Tackle Metrology Needs for 0.13-Micron, 300-mm Production

06/30/2000  SAN JOSE, Calif.--June 30, 2000--KLA-Tencor Corp. has introduced a new generation of in-line CD scanning electron microscopes (SEMs) for next-generation lithography and etch applications. The tools are designed for use as a fab transitions to 0.13-?m node and 300-mm manufacturing.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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