Lithography

LITHOGRAPHY ARTICLES



Cymer Receives Additional Funding From SEMATECH

06/27/2000  SAN DIEGO, Calif.--June 22, 2000--Cymer has received additional funding from International SEMATECH to develop of production-worthy lasers for lithography applications.

Photronics and ASML to Develop Reticles for 0.10-Micron Imaging Technologies

06/22/2000  JUPITER, FL--June 20, 2000--Photronics and ASML are developing reticles for 0.10-?m imaging technologies.

TSMC Purchases 300mm platform from ASM Lithography

06/20/2000  Veldhoven, Netherlands--June 20, 2000--TSMC has just received an ASM Lithography 300-mm platform. This is ASM's first order received for this new technology.

HD MicroSystems Introduces Photodefinable Polyimide

06/16/2000  WILMINGTON, Del.--June 16, 2000--HD MicroSystems has introduced a photodefinable polyimide developed for single mask, stress buffer passivation applications on DRAMs, SRAMs, logic devices, and microprocessors.

Cymer Flourine Laser UltraTech's New Lithography Tool

06/13/2000  SAN DIEGO, CA--June 12, 2000--Cymer announced last week the shipment of its first ELX-6500F2 laser to Ultratech Stepper.

Carl Zeiss to Deliver Advanced Optics to International SEMATECH and Extreme Ultraviolet LLC

05/31/2000  MUNICH, Germany--May 30, 2000--International SEMATECH, Carl Zeiss, and the EUV LLC announced a program to demonstrate advanced optics for extreme ultraviolet lithography.

SVG's Micrascan Lithography Platform Designed to Convert From 248 NM to 157 NM

05/11/2000  WILTON, CONN--May 11, 2000--Semiconductor manufacturers can now use one platform as they convert to 300 mm with a product designed to evolve lithography from 248 nm to 193 nm to 157 nm. Silicon Valley Group's Micrascan supports a variety of optical trains accommodating the adjustment in technology without requiring changes in tools or in the fab itself, says a company official.

In the News

05/01/2000  Capitalizing on advanced intellectual property (IP) delivery and rapid silicon prototyping tools (two of the major dividends that resulted from its recent acquisition of VLSI Technology), Philips Semiconductors has launched a design methodology that will allow the vast pool of IP to be used quickly and effectively.

Products -- April 26, 2000--Intel To Ship Its First 0.18-micron Flash Chip This Fall

04/26/2000  Intel has announced a Fall volume production of its Advanced+ Boot Block flash chip, the company's first flash memory product on 0.18-?m lithography.

Re-organization -- April 21, 2000 -- Utratech Stepper Closes UltraBeam Business

04/24/2000  Ultratech Stepper has closed its UltraBeam Lithography business.

Financials -- April 18, 2000 -- Texas Instruments First Quarter Revenues up 27%

04/19/2000  Texas Instruments reaped the rewards of the Internet-backed bandwidth push last quarter with revenues of $2.653 billion. The technology giant cited digital signal processor (DSP) deals with Cisco and Sony that pushed revenues up 27 percent from 1999's first quarter and up 4 percent sequentially.

Acquisition -- March 15, 2000 -- Photronics Buys Taiwan Position with PSMC Purchase

03/15/2000  Photronics sees its international ties strengthen with its acquisition of Taiwan's Precision Semiconductor Mask Corp.

Equipment Purchase -- March 13, 2000 --Silterra Invests $150 Million in All-scanner Based Equipment

03/13/2000  Silterra's purchase of $150 million in equipment for its new foundry will support the startup's plan to increase production to 30,000 8-inch wafers per month by 2002, officials say. One purchase already made by the company is Asyst Technology Inc.'s SMIF-LPT product line. Silterra has also contracted with ASM Lithography (ASML) as its lithography supplier.

Catching e-business wave, AvantCom wants to link fabs, equipment suppliers

02/17/2000  Hoping to catch the e-business wave crashing over the chip industry, business-to-business network provider AvantCom Network wants to link semiconductor fabs with their tool suppliers, with the goal of allowing equipment firms to retrieve real-time tool status and parametric data from their installed tool base.

With planned FINLE buy, KLA-Tencor gets litho simulation, analysis

02/11/2000  In an effort to enhance its lithography module control offerings, KLA-Tencor plans to acquire FINLE Technologies, a 10-year old developer of lithography simulation and data analysis software.

Hitachi raises 2000 capex to $1.4B

02/10/2000  In yet another boost to capital spending, Japan chipmaker Hitachi said it will invest 150 billion yen (about US$1.4 billion) in the semiconductor field in fiscal year 2000.

Japan, US firms diverge on lithography approaches

11/02/1999  Advantest, Hitachi, and Japanese R&D consortia are developing cell-projection e-beam lithography, whereas US manufacturers are emphasizing EUV and SCALPEL, both of which require potentially expensive masks.

Inventor's Corner

11/01/1999  Syringe Body Handling Device...Fume Hood Control System...Mobile Ion Contamination Cure...Cleanroom Ceiling Bracket and Fastener...Cleanroom Mask...Disk Storage Device...Garment Fabric

ETCH: Addressing Cu contamination via spin-etch cleaning

11/01/1999  While a wafer backside and back edge can be hermetically sealed and protected from copper contamination during electroplating, the front-side exclusion zone and beveled edge are still vulnerable because clamping during electroplating is not a totally effective mask.

Phase-shift technology for lithography tool performance evaluation

08/05/1999  With the bulk of lithography equipment users searching for effective methods to push the resolution limits of their steppers, a test reticle that implements patented phase-shift technology is making it possible to rapidly and accurately analyze focus-related anomalies, characterize system and lens performance, and extend system capabilities to enhance overall tool performance.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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