Lithography

LITHOGRAPHY ARTICLES


Japan Battles E.coli "Epidemic"

09/01/1996  Sakai, Osaka, Japan--After seven deaths and more than 9,000 people struck ill by the deadly E.coli 0157:H7 virus, the Japanese government has mandated new contamination control precautions in its food handling systems to stop the spread of the pathogen.
Face mask

07/01/1996  Tecnol Industrial Safety has introduced a new and improved CR Classic face mask that is available with headbands. The CR Classic with a double headband is intended for working in Class 10 or better critical environments. Its interfacing is made of BiCoSof, a material that is soft and non-irritating. With a 99 percent particle filtration efficiency at 0.1-micron rating, the mask can provide protection for a variety of cleanroom environments. The CR Classic is Tecnol Catalog number 45125.
Minienvironment

07/01/1995  C.Z. Instruments is launching Jenoptik`s SMIF/Minienvironment, providing ultra-clean conditions directly around the product and allowing a less stringent cleanroom environment outside the enclosure. Jenoptik`s SMIF line includes: SMIF Lean Robot Series SLR; SMIF enclosure; SMIF Sort and Merge Station (SSM 150C); and SMIF Notchfinder (SNF 200 SA). According to the company, the SMIF/Minienvironment eliminates the need for special clothing, face masks and other contamination risk precautions. The S



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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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