Lithography

LITHOGRAPHY ARTICLES



SkyWater significantly expands pure-play technology foundry customer base

11/16/2017  SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

Marvell Semiconductor president and CEO Matt Murphy elected chair of SIA

11/16/2017  The Semiconductor Industry Association today announced the SIA Board of Directors has elected Matt Murphy, president and CEO of Marvell Semiconductor, Inc., as its 2018 Chair and Sanjay Mehrotra, president and CEO of Micron Technology, Inc., as its 2018 Vice Chair.

Electronics industry conference to debut in Kuala Lumpur

11/15/2017  SEMICON Southeast Asia 2018 to bolster growing semiconductor industry in the region.

Seoul Semiconductor introduces an Acrich-based compact LED lriver with 5X the power density of conventional drivers

11/15/2017  Seoul Semiconductor has developed an ultra-compact LED driver series with a power density 5X higher than conventional LED drivers.

Will Samsung's 2017 semi capex deliver knockout blow to competition?

11/15/2017  The company’s $26 billion in 2017 outlays expected to be more than Intel and TSMC combined.

Gigaphoton announces new roadmap for DUV light source

11/14/2017  Gigaphoton Inc., a manufacturer of light sources used in semiconductor lithography, announced its intention to draw up a new roadmap with the aim of improving the availability of the equipment, and also to respond to the needs of the semiconductor chip manufacturers who are being confronted with increasingly high demands.

SUNY Poly, IBM celebrates 20th anniversary of copper interconnects during Albany nanotechnology symposium

11/14/2017  SUNY Polytechnic Institute (SUNY Poly) is hosting the 11th IEEE Nanotechnology Symposium at its world-class Albany NanoTech Complex on Wednesday, November 15, from 9 a.m. to 5:30 p.m.

First SEMICON Europa opens this year in co-location with productronica

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

2017 Global Semiconductor Alliance Award nominees announced

11/09/2017  The Global Semiconductor Alliance (GSA) today announced the 2017 award nominees for the GSA Awards Dinner Celebration.

EUV leads the next generation litho race

11/08/2017  As previously reported by Solid State Technology, the eBeam Initiative recently reported the results of its lithography perceptions and mask-makers' surveys. After the survey results were presented at the 2017 Photomask Technology Symposium, Aki Fujimura, CEO of D2S, the managing company sponsor of the eBeam Initiative, spoke with Solid State Technology about the survey results and current challenges in advanced lithography.

Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

The intelligence that leads to artificial intelligence

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

Semiconductor super cycle: Market trends, drivers and forecasts

11/08/2017  2017 will be a record-breaking year. Semiconductor sales will exceed $400 billion for the first time and semiconductor equipment sales will finally shatter the historic high set in 2000. What is driving this growth?

Third quarter 2017 silicon wafer shipments hit another quarterly record

11/08/2017  Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

2017 sees advances in connected devices, memory

11/07/2017  The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

How to solve the BEOL RC delay problem?

11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

Broadcom proposes to acquire Qualcomm

11/06/2017  The Broadcom proposal stands whether Qualcomm's pending acquisition of NXP Semiconductors N.V. is consummated on the currently disclosed terms of $110 per NXP share or the transaction is terminated.

Global semiconductor industry posts highest-ever quarterly sales

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

GlobalFoundries' momentum in China

10/23/2017  Company shares details of technology roadmap and customer adoption in the world’s fastest-growing market for semiconductors.

North American semiconductor equipment industry posts September 2017 billings 

10/20/2017  Global semiconductor equipment billings of North American headquartered suppliers for September were $2.0 billion, down 12 percent from the peak level set in June of this year.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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