03/14/2017  SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $41.24 billion in 2016, representing a year-over-year increase of 13 percent.

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

03/10/2017  Updated forecast shows total semiconductor shipments surpassing one trillion devices in 2018.

03/09/2017  Soitec has announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd.

03/08/2017  New IQ Aligner NT achieves double throughput and alignment accuracy over previous-generation platform; opens up new applications for EVG lithography solutions.

03/07/2017  Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record ? more than US$46 billion in 2017.

03/06/2017  Cypress Semiconductor Corp. (Nasdaq: CY) today announced it has sold the subsidiary that owns its semiconductor wafer fabrication facility in Bloomington, Minnesota to SkyWater Technology Foundry for $30 million.

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

03/02/2017  Three of the top 11 companies are expected to increase capex spending by 25% or more.

02/28/2017  Cadence Design Systems, Inc. today announced the Cadence Litho Physical Analyzer (LPA) Production Lithography Unified Solution (PLUS) developed in partnership with ASML, which seamlessly provides foundry-enabled lithography simulation capabilities during chip design implementation and signoff.

02/28/2017  The eBeam Initiative today announced that Semiconductor Manufacturing International Corporation (SMIC)--one of the world's leading global foundries--has joined its ranks.

02/28/2017  Semiconductor Research Corporation today announced that TSMC has signed an agreement to participate in two SRC research initiatives.

02/27/2017  At the SPIE Advanced Lithography conference in San Jose, Calif. (USA), imec and its partners will present a patterning solution for a 42nm-pitch M1 layer and a 32nm-pitch M2 layer in logic design compatible with the foundry N5 requirements.

02/23/2017  Company demonstrates that magnetic-field debris mitigation, a new technology, extends collector mirror lifetime in Pilot light source for EUV lithography mass production plants, a major step towards eliminating bottlenecks.

02/23/2017  South Korea narrows gap with Taiwan; China shows biggest increase, accounts for nearly 11%.

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

02/20/2017  EUV, cobalt contacts, are expected to be introduced at the 7nm node by several semiconductor manufacturers.